Multi-Layer Wiring Substrate Cavity Design for Routing Flexibility
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Solution Overview
Problem
The existing semiconductor devices with single-layer wiring structures face limitations in wiring routing flexibility and reliability due to low degree of freedom, making it difficult to accommodate high-performance chips with various pad layouts and leading to potential damage of multi-layered wiring layers during bending.
Innovation Solution
A wiring substrate with a multi-layered structure is developed, featuring a metal plate with defined wiring regions, a cavity, and a concave frame-shaped edge, allowing the multi-layered wiring layer to be formed without bending, thus maintaining insulation layer integrity and enabling higher wiring density and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single wiring layer is used, then the device complexity is reduced, but the degree of freedom of wiring routing is low making it difficult to cope with various pad layouts
Solution Approach 1:
The patent transitions from a single-layer wiring structure to a multi-layer wiring structure, adding the vertical dimension to the wiring layout. This allows wires to route through multiple layers (first wiring layer, second wiring layer, third wiring layer) connected by via holes, providing significantly increased routing flexibility to accommodate various pad layouts while maintaining manageable device complexity through systematic layer organization.
2Adaptability or versatility
If a multi-layered wiring layer is used to improve wiring routing flexibility, then the degree of freedom of wiring routing is improved, but the cured interlayer resin layer may be damaged during bending reducing reliability
Solution Approach 1:
The patent extracts and removes the metal plate from the final semiconductor device structure. The metal plate serves as a temporary support structure during manufacturing that enables the multi-layer wiring and interlayer resin to be formed without damage. After serving its purpose, the metal plate is removed, leaving the reliable multi-layer wiring structure without the risk of bending damage to the cured interlayer resin.
Solution Approach 2:
The patent performs preliminary actions by forming the complete multi-layer wiring structure, via holes, and interlayer resin layers while the metal plate is still in place providing structural support. This allows the fragile multi-layer structure to be created without damage, and only after this preliminary formation is complete is the metal plate removed to prevent any subsequent bending damage.
3Adaptability or versatility
If the wiring layer is configured by a multi-layered wiring layer, then the degree of freedom of wiring routing is improved, but the multi-layered wiring layer is bent at the same time causing damage to cured interlayer resin layer
Solution Approach 1:
The metal plate is extracted and removed from the structure after serving its manufacturing support function. This removal eliminates the source of bending stress that would damage the multi-layer wiring and interlayer resin during subsequent handling or packaging processes, thereby improving manufacturing reliability while preserving the routing flexibility benefits of the multi-layer structure.
Data Source
AI summary
A wiring substrate includes a metal plate in which at least one wiring formation region is defined, a cavity formed in the wiring formation region, a concave part formed to have a frame shape at a peripheral edge portion of a bottom portion of the cavity, a first pad disposed at a central portion of the bottom portion of the cavity, a wiring portion connected to the first pad and disposed on and extended along the central portion of the bottom portion of the cavity, a side surface of the concave part and a bottom surface of the concave part, and a multi-layered wiring layer disposed at the central portion of the bottom portion of the cavity so as to cover the first pad and a part of the wiring portion. The multi-layered wiring layer has a second pad provided at an upper surface-side and connected to the wiring portion.