Vehicular Sensor Cooling via Thermal Conduction Element
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Solution Overview
Problem
Modern vehicle sensing systems, such as those using RADAR, LIDAR, or cameras, face challenges in heat management due to high-performance integrated circuits generating heat, which needs to be efficiently transferred out of the sensor housing to ensure compliance and optimal performance.
Innovation Solution
Incorporating a thermally conductive element that extends from the rear housing and is coupled with the circuit board to effectively transfer heat away from the processor, utilizing metallic materials for enhanced heat dissipation, and optionally including heat sinks for further cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high-performance integrated circuits are used in vehicle sensing systems, then sensing performance and detection capability are improved, but heat generation increases and thermal management becomes difficult
Solution Approach 1:
The patent extracts the thermal management function from the housing structure by introducing a dedicated thermally conductive element that extends from the rear housing to the circuit board. This separate thermal pathway removes heat away from the sensing components without interfering with the sensing performance, effectively decoupling the thermal management function from the structural housing.
Solution Approach 2:
The thermally conductive element acts as an intermediary between the heat-generating circuit board and the rear housing. This mediator component provides a dedicated thermal pathway that transfers heat from the high-performance integrated circuits to the housing, which then dissipates it to the environment, thereby managing the thermal load without affecting the sensing performance.
2Temperature
If thermally conductive materials are added to the sensor housing, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The rear housing serves multiple functions: it provides structural support, electrical shielding, and thermal dissipation. By making the rear housing thermally conductive, it simultaneously acts as both a structural component and a heat sink, eliminating the need for separate cooling components and reducing overall device complexity.
Solution Approach 2:
The patent merges the thermal management function with the existing rear housing structure by incorporating thermally conductive materials into it. This integration combines the structural and thermal management roles into a single component, avoiding the addition of separate complex cooling systems while effectively dissipating heat from the sensing device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures efficient heat dissipation, maintaining the performance and reliability of vehicle sensing systems by effectively managing heat generated during operation, thereby ensuring compliance and optimal system functionality.
Implementation Method 1
The sensor includes a thermal element that is thermally coupled at a circuit board of the sensor (that has an integrated circuit or processor thereat) to draw heat (that is generated by operation of the sensor) away from the circuit board and to a distal rear housing portion of the sensor. The thermal element may be part of the rear housing portion and both may comprise metallic thermally conductive materials.
Data Source
AI summary
A sensing device for a vehicular sensing system includes a housing having a front housing portion and a metallic rear housing portion. A first printed circuit board and a second printed circuit board are disposed in the housing. The second printed circuit board is electrically connected to the first printed circuit board, which has an electrical connector for electrically connecting the sensing device to a vehicle wire harness. The second printed circuit board has circuitry thereat, with the circuitry generating heat when the sensing device is operating. The rear housing portion comprises a thermally conductive element that extends through an aperture of the first printed circuit board and is thermally coupled at the second printed circuit board. The thermally conductive element conducts heat generated by the circuitry of the second printed circuit board to the rear housing portion to dissipate the heat from the sensing device.