3D Multilayer Interconnect Device with Embedded PCB
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Solution Overview
Problem
Existing technologies fail to create 3D interconnect devices with multiple interconnection layers while providing extra interior room, which is necessary for advanced radar and telecom applications like AESA antennas that require high bandwidth and scan-angle performance.
Innovation Solution
A method involving laminating a multilayer printed circuit board within a 3D mold, injecting molding material to form a non-planar structure, and metallizing the outer surface to create a 3D interconnect device with multiple layers, using materials like Rogers 4003 and thermoset or thermoplastic resins, and pre-treating the PCB with alkaline and sulfuric-peroxide chemistry for adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If 3D-MID technology is used to create a hollowed 3D plastic body with metallized outer surface, then extra interior room is achieved, but the number of interconnection layers is limited to two
Solution Approach 1:
The patent embeds a multilayer printed circuit board (with multiple interconnection layers) inside the hollowed 3D plastic body, creating a nested structure where the PCB is contained within the molded interior space. This allows the device to maintain extra interior room while incorporating multiple interconnection layers through the embedded PCB structure.
Solution Approach 2:
The patent transitions from surface-level metallization (2D interconnection) to volumetric multilayer interconnection by embedding a multilayer PCB within the 3D molded body. This adds the dimension of multiple conductive layers through the thickness of the PCB, enabling more than two interconnection layers while preserving the 3D interior space.
2Ease of manufacture
If single or double metallization layers are used in 3D-MID package modules, then manufacturing is simplified, but bandwidth and scan-angle performance are limited
Solution Approach 1:
The patent pre-fabricates the multilayer interconnection structure on the printed circuit board before embedding it in the molded body. The multilayer PCB is manufactured with all required conductive traces and patterns already in place, allowing complex high-performance interconnections to be created in advance using standard PCB manufacturing techniques, then integrated into the 3D structure.
3Device complexity
If planar interconnect substrate technologies are used, then multilayer interconnection is achieved, but extra interior room for RF components is not provided
Solution Approach 1:
The patent combines planar multilayer PCB technology with 3D molded packaging by embedding the flat multilayer PCB inside a hollowed 3D plastic body. This creates a three-dimensional package structure that provides interior volume for RF components while maintaining the multilayer interconnection capability of planar PCB technology through the embedded board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of 3D multilayer interconnect devices that integrate electrical functions and mechanical features, offering higher bandwidth and scan-angle performance than existing technologies, while allowing for flexible dielectric thickness and component assembly.
Implementation Method 1
a step of injecting a molding material into the mold, so as to form a three-dimensional non-planar structure encompassing the printed circuit board
Implementation Method 2
a step of metallizing a portion of the outer surface of the three-dimensional structure, so that it is connected with at least one interconnection layer of the printed circuit board
Implementation Method 3
pre-treating the PCB with alkaline and sulfuric-peroxide chemistry for adhesion
Data Source
Figure 1a~1d
AI summary
There is disclosed a method for making a three-dimensional interconnect device, the device comprising a plurality of interconnection layers. The method comprises a step of laminating a printed circuit board comprising a plurality of interconnection layers. The method comprises a step of inserting the printed circuit board in a three-dimensional mold. The method comprises a step of injecting a molding material into the mold, so as to form a three-dimensional structure encompassing the printed circuit board. The method comprises a step of metallizing a portion of the outer surface of the three-dimensional structure, so that it is connected with at least one interconnection layer of the printed circuit board. Application : detection, telecom.