Helix Substrate 3D Package for High I/O Density
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Solution Overview
Problem
Conventional 3D semiconductor packages are limited by the number of Input/Output (I/O) contacts and the number of stacked IC dies, which restricts their functionality and density compared to traditional packages.
Innovation Solution
A substrate with a columnar part and multiple helix-shaped stairs is used, allowing for increased I/O contacts and stacked IC dies, where IC dies are bonded to the supporting surfaces of the stairs and encapsulated with packaging material, enabling more functions per unit space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional 3D packages use stacked IC dies or stacking and connecting completed packages, then the package structure is simple to manufacture, but the number of I/O contacts and stacked dies is limited
Solution Approach 1:
The patent transitions from conventional planar or simple stacked 3D package structures to a helical three-dimensional structure. The helix substrate arrangement allows IC dies to be stacked along a spiral path, effectively utilizing vertical and radial space dimensions simultaneously. This dimensional transformation enables significantly higher I/O contact density and greater number of stacked dies within the same package footprint without proportionally increasing manufacturing complexity.
2Productivity
If the number of I/O contacts and stacked dies is increased, then the functional density is improved, but the manufacturing complexity increases
Solution Approach 1:
The helix substrate is segmented into multiple discrete stacking positions arranged along the spiral path, with each position capable of holding an IC die. This segmentation allows for modular assembly where dies can be individually placed at predetermined locations. The segmented structure also enables selective bonding and connection at each stacking position, facilitating high functional density while maintaining manageable manufacturing complexity through standardized repetitive units.
3Volume of moving object
If more IC dies are stacked in a given space, then the size reduction is achieved, but the assembly difficulty increases
Solution Approach 1:
The patent employs a helical curved structure instead of straight vertical stacking. The spiral geometry of the helix substrate provides a natural progressive path for die placement, allowing assembly equipment to follow the curved trajectory and place dies sequentially along the helix. This curvature-based design enables compact packaging with more dies in reduced volume while maintaining assembly ease through the intuitive sequential placement path that the helical structure provides.
Data Source
AI summary
A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes twisted around the columnar part. Semiconductor integrated circuits (IC dies) are attached on one or both of the supporting surfaces of the stairs. The columnar part, the stairs and the IC dies can be encapsulated with a mold compound.