In-Mold Electronics Structure with Plated Circuit and Light Guides
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Solution Overview
Problem
Current in-mold electronics (IME) manufacturing processes are restricted by the shape of the lower film, leading to complex configurations and limitations in conductive circuit design, and often require multiple films and intricate processes.
Innovation Solution
The IME structure incorporates a film with a first and second plastic resin, where an electronic circuit is formed on the surface of the second resin using a plating method, and electronic elements, including LED light sources, are mounted, with light guides and encapsulants to manage lighting, and the resins are assembled using adhesive layers or assembly members for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a two-film method is used to form conductive circuits and electronic components, then the electronic circuit can be integrated with the film structure, but the configuration of the conductive circuit is restricted by the shape of the lower film and the process becomes considerably complicated
Solution Approach 1:
The patent merges the conductive circuit formation process with the plastic resin molding process by using a single film structure. The conductive circuit pattern is formed directly on the plastic film before molding, eliminating the need for separate lower film processing steps and enabling flexible circuit configurations adapted to the molded shape.
Solution Approach 2:
The patent extracts the conductive circuit formation step from the traditional two-film sequence and integrates it into the single-film workflow. The conductive circuit is formed on the plastic film using printing or plating methods before the film is molded, separating the circuit formation from the lower film processing and simplifying the overall process.
2Reliability
If electronic components are mounted on the film before molding, then the components can be integrated into the final product, but the process becomes considerably complicated and time-consuming
Solution Approach 1:
The patent applies preliminary action by forming the conductive circuit pattern on the plastic film before the molding process. This allows the circuit structure to be pre-established and integrated with the component mounting, ensuring reliable electrical connections while streamlining the manufacturing sequence to improve productivity.
3Device complexity
If a single film is used to form both the design and electronic circuit, then the process is simplified, but the conductive circuit configuration is limited by the film shape
Solution Approach 1:
The patent resolves this contradiction by forming the conductive circuit pattern in a different dimension or sequence than the film shaping. The conductive circuit is created on the flat film surface using printing or plating methods before the film is molded into its final three-dimensional shape, allowing independent optimization of both the film geometry and circuit layout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, enhances durability, and allows for efficient control and guidance of light emission from LED elements, providing a robust and aesthetically versatile IME structure suitable for automotive and home appliance applications.
Implementation Method 1
an electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method
Implementation Method 2
the first and second plastic resins may be bonded together by using an adhesive layer
Implementation Method 3
the electronic elements include an light-emitting diode (LED)
Data Source
AI summary
Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.