LED Interconnect Assembly with Resilient Contacts
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Solution Overview
Problem
Existing LED assemblies require soldering or conductive adhesives for electrical and thermal connections, which are costly and difficult to assemble, and often necessitate the use of printed circuit boards, increasing production costs and complexity.
Innovation Solution
A light-emitting device assembly featuring a contact carrier with resilient contacts, a heat sink for thermal management, and a securing member that allows for electrical and thermal engagement without soldering or adhesives, using a molded interconnect device as a substrate to facilitate easy assembly and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or conductive adhesives are used for electrical and thermal connections, then reliable electrical and thermal connection is achieved, but manufacturing cost increases and assembly difficulty increases
Solution Approach 1:
The patent replaces the chemical bonding process (soldering or adhesive bonding) with a mechanical connection system. The molded interconnect device incorporates resilient electrical contacts that mechanically engage with the LED leads, and the heat sink mechanically attaches to the LED body. This mechanical engagement achieves both electrical connection and thermal management without requiring soldering or adhesives, thereby improving ease of manufacture while maintaining connection reliability.
2Reliability
If printed circuit board is used for electrical connection, then electrical connectivity is achieved, but device complexity and production cost increase
Solution Approach 1:
The patent merges the functions of the printed circuit board, electrical contacts, and mounting structure into a single molded interconnect device. The molded interconnect device is formed as an integrated component that simultaneously provides electrical connection through resilient contacts, mechanical support, and alignment features. This integration eliminates the need for separate PCB and simplifies the assembly process, reducing device complexity while maintaining reliable electrical connection.
3Reliability
If traditional mounting methods are used, then electrical connection is achieved, but thermal management becomes difficult and heat dissipation efficiency decreases
Solution Approach 1:
The patent segments the thermal management function from the electrical connection function. The LED assembly is divided into distinct components: the molded interconnect device handles electrical connection, while a separate heat sink component handles thermal management. The heat sink directly contacts the LED body (excluding the lead engagement area), creating a dedicated thermal pathway that efficiently conducts heat away from the LED without interfering with the electrical connection mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables cost-effective, easy assembly and maintenance of LED assemblies with improved thermal management, extending LED lifespan and allowing operation in harsh environments without the need for printed circuit boards.
Implementation Method 1
the contacts of the contact carrier are resilient, the leads of the light-emitting device mechanically engage the resilient contacts
Implementation Method 2
a heat sink thermally coupled to the light-emitting device, the heat sink drawing heat away from the light-emitting device
Implementation Method 3
a securing member, the securing member extending through the contact carrier and into the heat sink to retain the contact carrier and the light-emitting device in position
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A light-emitting device assembly (2) which can be used in many applications has a contact carrier, at least one light-emitting device (10), a heat sink and at least one securing member (300). The contact carrier has a light-emitting device receiving region and resilient contacts which are provided proximate to the light-emitting device receiving region. The at least one light-emitting device (10) has leads which extend therefrom to mechanically and electrically engage the resilient contacts. The heat sink is thermally coupled to the at least one light-emitting device (10). The at least one securing member (300) extends through the contact carrier and into the heat sink to releasably retain the contact carrier and the at least one light-emitting device (10) in position relative to each other and relative to the heat sink.