3D Circuit Part Resin-Plating Structure for Heat Dissipation
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Solution Overview
Problem
Molded interconnect devices (MIDs) face challenges in heat dissipation and circuit density due to difficulties in forming thin insulating resin layers on three-dimensional metal surfaces and preventing plating film spread during circuit wiring formation.
Innovation Solution
A three-dimensional circuit part is designed with a metal member, a resin layer, and circuit wiring with a specific surface roughness and thickness configuration, including a multi-stage groove structure for the plating film, to enhance heat dissipation and circuit density while preventing plating film spread.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness of the resin layer is reduced to improve heat conduction, then heat dissipation is improved, but it becomes difficult to form a uniform thin insulating resin layer on the three-dimensional surface
Solution Approach 1:
The patent applies different surface roughness characteristics to different regions of the metal member. The overlap region (where wiring and mount regions coincide) is given a specific surface roughness Rz of 10-120 μm to enable thin resin adhesion and heat conduction, while other regions maintain different characteristics. This local differentiation allows the resin layer to be uniformly thin where needed without compromising manufacturing feasibility.
2Temperature
If the thickness of circuit wiring is increased to ensure heat dissipation, then heat dissipation is improved, but the plating film spreads in the line-width direction making it difficult to increase circuit density
Solution Approach 1:
The patent transitions from controlling plating film width in two dimensions to controlling it through three-dimensional groove structures. By forming grooves with specific depths and widths in the resin layer, the plating film is confined vertically and laterally, preventing spread while maintaining necessary thickness for heat dissipation. This dimensional approach to confinement solves the line-width control problem.
3Volume of moving object
If the circuit density is increased to reduce device size, then device compactness is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent creates local heat dissipation pathways by forming grooves in the resin layer above the overlap region. These grooves allow heat to conduct from the mounted component through the circuit wiring directly to the metal member in specific localized areas, while maintaining high circuit density in other regions. This local optimization enables compact design without sacrificing heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high heat dissipation and increased circuit density while maintaining effective insulation and adhesive strength, improving the performance of MIDs in electronic devices.
Implementation Method 1
first circuit wiring including plating film provided on a wiring region of a surface of the first resin layer
Implementation Method 2
The first resin layer may contain a thermosetting resin, and the thermosetting resin may be an epoxy resin
Data Source
AI summary
A circuit part that provides high heat dissipation is provided. A three-dimensional circuit part includes: a metal member; a first resin layer provided on top of the metal member; first circuit wiring including plating film provided on a wiring region of the surface of the first resin layer; and a first mounted component mounted on a mount region of the surface of the first resin layer to electrically connect to the first circuit wiring. In the surface of the first resin layer, the wiring region and the mount region overlap in an overlap region, and the surface roughness Rz of the overlap region is 10 μm to 120 μm; and the minimum distance between the first circuit wiring and the face of the first resin layer facing the metal member within the overlap region is 10 μm to 100 μm.