Printed Circuit Details TRIZ Cases

See how a PCB-integrated heat dissipation pad and two-dimensional patterns reduce terminal temp

See how a guide wall and protective body segmentation redirect melted materials to contain PCB

See how a segmented heat sink and removable cover improve electric unit cooling efficiency whil

Fiber-laser continuous grooves help thin, high-strength ceramic substrates split cleanly with less chipping, cracking, and handling damage.

Counter electrodes placed on different insulator layers overlap separate signal lines to cut coupling, improve shielding, and reduce transmission loss.

Varying planar and connecting electrode structures creates multiple resonances, widening high-frequency stopbands without extra layers.

Limiting Cu at the Ag interface prevents eutectic melting, so the metal layer stays bonded and conductive at high temperatures.

Wireless charging and battery-based power switching stabilize FPCB power delivery in a rollable display during sliding movement.

A narrowed PCB bend region with through holes lets rigid boards fit curved surfaces for antenna integration without flexible PCB cost.

A flexible PCB with an integrated GaNFET controller turns standard solenoids into compact constant-current assemblies for easier retrofitting.

Radial capacitor trees overlap an on-chip inductor to meet metal fill rules while gaps interrupt eddy currents and preserve transceiver performance.

Direct antenna buckle integration removes adapters, cuts signal loss and impedance mismatch, and helps the front-end chip resist noise.

Independently controlled switch sets reconfigure series and parallel current paths to improve safety and reliability in high-density power control.

A corrosion-resistant barrier layer between the metal base and electrode prevents salt-water damage while preserving heat dissipation.

Bent metal sheets and strip conductors widen patch antenna beams to 132.4° for omnidirectional arrays with fewer elements and lower complexity.