Semiconductor Package Underfill Layout for Targeted PCB Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor devices fail to efficiently dissipate heat generated by high-power semiconductor chips, such as those in antenna in package (AiP), due to insufficient thermal conductivity of the filling materials used in the gap between the semiconductor package and the printed circuit board.
Innovation Solution
A semiconductor device is designed with a metal plate embedded in the printed circuit board, where a first filling material with moderate thermal conductivity fills the gap covering connection terminals, and a second filling material with higher thermal conductivity fills the region where the semiconductor chip and metal plate overlap, enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin-based underfill material is used to fill the gap between the semiconductor package and the printed circuit board, then bonding strength and reliability are improved, but thermal conductivity is insufficient for efficient heat dissipation
Solution Approach 1:
The patent applies local quality by using different filling materials with different thermal conductivities in different regions of the gap. Specifically, a first filling material with moderate thermal conductivity fills the entire gap for bonding, while a second filling material with higher thermal conductivity is selectively applied in the region where the semiconductor chip and metal plate overlap, creating a localized thermal conduction path that addresses heat dissipation needs without compromising overall bonding strength.
Solution Approach 2:
The patent employs composite materials by combining two different filling materials - a resin-based underfill material (first filling material) and a thermally conductive material (second filling material). This composite approach allows the device to simultaneously achieve the bonding strength and reliability provided by the resin-based material and the enhanced thermal conductivity provided by the thermally conductive material in the critical heat dissipation region.
2Temperature
If a filling material with high thermal conductivity is used to improve heat dissipation, then thermal resistance is reduced, but bonding strength may be compromised
Solution Approach 1:
The patent applies local quality by using different filling materials with different thermal conductivities in different regions of the gap. Specifically, a first filling material with moderate thermal conductivity fills the entire gap for bonding, while a second filling material with higher thermal conductivity is selectively applied in the region where the semiconductor chip and metal plate overlap, creating a localized thermal conduction path that addresses heat dissipation needs without compromising overall bonding strength.
Solution Approach 2:
The patent employs composite materials by combining two different filling materials - a resin-based underfill material (first filling material) and a thermally conductive material (second filling material). This composite approach allows the device to simultaneously achieve the bonding strength and reliability provided by the resin-based material and the enhanced thermal conductivity provided by the thermally conductive material in the critical heat dissipation region.
3Temperature
If the entire gap is filled with high thermal conductivity material, then heat dissipation is maximized, but manufacturing complexity and material cost increase
Solution Approach 1:
The patent applies local quality by using different filling materials with different thermal conductivities in different regions of the gap. Specifically, a first filling material with moderate thermal conductivity fills the entire gap for bonding, while a second filling material with higher thermal conductivity is selectively applied in the region where the semiconductor chip and metal plate overlap, creating a localized thermal conduction path that addresses heat dissipation needs without compromising overall bonding strength.
Solution Approach 2:
The patent applies partial action by using the high thermal conductivity second filling material only in the specific region where heat dissipation is most critical (the overlap region of the semiconductor chip and metal plate), rather than filling the entire gap with this material. This selective application reduces material cost and manufacturing complexity while still achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces thermal resistance and enhances heat dissipation efficiency from the semiconductor chip by utilizing materials with varying thermal conductivities, ensuring both strong bonding and efficient heat transfer.
Implementation Method 1
a second filling material with higher thermal conductivity than the first filling material fills at least a part of a second region, where the semiconductor chip and the metal plate overlap in a plan view
Data Source
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AI summary
Heat generated by a semiconductor chip is efficiently dissipated. A metal plate 12 is embedded in a printed circuit board 11. A semiconductor package 13 includes a semiconductor chip 13a and is provided with connection terminals 13g1 to 13g4, which electrically connect the semiconductor chip 13a and the printed circuit board 11, on a surface 13i that faces a surface 11a of the printed circuit board 11. Out of a gap between the surface 11a and the surface 13i, a first region that covers the connection terminals 13g1 to 13g4 is filled with a first filling material 14, and in the gap, at least a part of a second region where the semiconductor chip 13a and the metal plate 12 overlap in plan view is filled with a second filling material 15 with higher thermal conductivity than the first filling material 14.