Semiconductor Package Cutting with Trench-Guided Layer Segmentation
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Solution Overview
Problem
The challenge in manufacturing semiconductor packages with insulating resin layers and wiring layers is that cutting methods suitable for one material often cause damage to the other due to differing physical properties, particularly when the base material contains a hard resin with inorganic fillers, leading to delamination or damage.
Innovation Solution
A method involving an intermediate structure with a base material and redistribution layer, where the resin portion is cut separately from the insulating resin layer, using specific cutting techniques to form wiring structures, and incorporating sealing structures and underfill layers to protect the insulating resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a cutting method suitable for the hard resin portion containing inorganic fillers is used, then the resin portion can be cut effectively, but the insulating resin layer constituting the wiring layer is likely to suffer delamination or damage
Solution Approach 1:
The patent divides the cutting process into two separate stages: first cutting the resin portion containing inorganic fillers, then cutting the insulating resin layer. This segmentation allows each cutting operation to use optimized parameters suitable for the specific material being cut, preventing damage to the other layer. The intermediate structure is cut along a first cutting line to separate the resin portion, and then the insulating resin layer is cut along a second cutting line, achieving both cutting objectives without mutual interference.
2Productivity
If the insulating resin layer and resin portion are cut simultaneously using the same method, then the process is simpler, but one of the materials is likely to be damaged due to different physical properties
Solution Approach 1:
The patent segments the cutting operation into two distinct sequential steps rather than attempting simultaneous cutting. The first step cuts the resin portion along a first cutting line, and the second step cuts the insulating resin layer along a second cutting line. This sequential segmentation ensures high cutting quality for each material type while maintaining overall process efficiency through automated execution of the multi-step process.
3Strength
If the base material contains a relatively hard resin portion with a lot of inorganic filler, then the mechanical strength is improved, but a cutting method suitable for this resin portion is liable to cause delamination or damage to the insulating resin layer
Solution Approach 1:
The patent addresses the harmful effect by segmenting the cutting process to isolate the high-strength resin portion cutting from the insulating resin layer. The first cutting line is specifically optimized for cutting the hard resin portion containing inorganic fillers, while the second cutting line is optimized for the insulating resin layer. This prevents the mechanical stresses from the first cutting operation from causing delamination or damage to the insulating resin layer.
Solution Approach 2:
The patent applies different cutting conditions and parameters to different regions of the intermediate structure. The first cutting line uses parameters optimized for the hard resin portion with inorganic fillers, while the second cutting line uses parameters optimized for the insulating resin layer. This local quality approach ensures that each material is cut with the most appropriate method, preventing damage while maintaining the mechanical strength benefits of the inorganic filler-containing resin.
Data Source
AI summary
A method for manufacturing a semiconductor package, including preparing an intermediate structure including a base material and a redistribution layer, the base material having a first main surface and a second main surface on a rear side of the first main surface, the redistribution layer being provided on the first main surface and having an insulating resin layer and wiring, the base material having a resin portion including a through portion that penetrates from the first main surface to the second main surface, the redistribution layer forming a trench having a bottom surface on which the through portion is exposed; and cutting the through portion along the trench, thereby forming a plurality of wiring structures, each having the divided base material.