Substrate Signal Line Layout With Conductive Patterns to Prevent Shorts
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Solution Overview
Problem
Existing display technologies face challenges in efficiently connecting signal lines to electronic components on a substrate, particularly in reducing manufacturing complexity and costs while minimizing short-circuiting risks.
Innovation Solution
The substrate design includes multiple signal line groups and conductive patterns arranged in a specific configuration, with signal lines extending from bonding regions to device regions, and conductive patterns connected through bridging parts, all within a single conductive layer to simplify manufacturing and reduce short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal lines are electrically connected to electronic components through multiple layers or complex routing, then signal transmission reliability is improved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent merges the signal line layer and conductive pattern layer into a single conductive layer, eliminating the need for separate routing and connection processes. This integration maintains electrical connectivity between signal lines and electronic components while significantly simplifying the manufacturing process and reducing the number of production steps.
Solution Approach 2:
The conductive patterns in the patent serve multiple functions: they act as both signal transmission paths and connection elements to electronic components. This multi-functionality eliminates the need for dedicated connection structures, reducing manufacturing complexity while maintaining reliable signal transmission and power delivery.
2Reliability
If multiple conductive layers are used to connect signal lines to device groups, then electrical connectivity is improved, but manufacturing steps and production costs increase
Solution Approach 1:
The patent combines signal line routing and device connection functions into a single conductive layer with integrated patterns. This eliminates the need for multiple sequential deposition and etching steps required for separate layers, reducing manufacturing complexity while maintaining robust electrical connectivity through the unified conductive structure.
3Reliability
If complex routing patterns are used to connect signal lines to device groups, then signal transmission effectiveness is improved, but risk of short-circuiting increases
Solution Approach 1:
The conductive patterns are strategically designed with varying densities and configurations in different regions: dense patterns near device groups for effective connection, and optimized spacing in routing areas to prevent short-circuits. This localized optimization maintains signal transmission effectiveness while minimizing harmful short-circuiting risks.
Solution Approach 2:
The conductive patterns serve as intermediary structures between signal lines and device groups, providing controlled connection points that prevent direct unwanted contact. These patterns act as mediators that ensure intentional electrical connections while preventing accidental short-circuits through their designed geometry and spacing.
4Reliability
If separate layers are used for signal lines and conductive patterns, then electrical isolation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges signal line and conductive pattern functions into a single conductive layer with integrated patterns. Electrical isolation is maintained through the pattern design itself rather than separate physical layers, eliminating the need for additional insulating layers and complex multi-layer structuring while preserving necessary electrical isolation between different signal paths.
Data Source
AI summary
A substrate, having edges, a device region, and at least one bonding region, includes a base, device groups, signal line groups, and conductive patterns. The device groups are along first and second directions. The signal line groups are on the same side as the device groups. A signal line group includes signal lines extending along the second direction, and arranged at intervals along the first direction. Any signal line extends from a bonding region to the device region, and is electrically connected to a column of device groups. The conductive patterns are on the same side as the device groups. At least one conductive pattern is in a region where a device group is located, and/or at least one conductive pattern is in a region between two adjacent device groups. At least one signal line in at least one signal line group is electrically connected to a conductive pattern.