Wireless Microprocessor Module With Direct Antenna Buckle Connection

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Solution Overview

Problem

Current wireless processor modules are large in size, require adapters for antenna connection, suffer from signal loss and impedance mismatches, and experience weak signal strength due to noise interference.

Innovation Solution

A wireless microprocessor module with an integrated antenna connection buckle and a front-end chip that enhances signal transmission by directly connecting to an antenna pin, reducing noise interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If an adapter is used to connect the antenna to the external connector, then the connection is established, but the device size increases and signal loss occurs

Engineering Contradiction:
Improveantenna connectionVSAvoidmodule size
Core Design Contradiction:
Ease of operationVSVolume of moving object

Solution Approach 1:

The patent merges the antenna connection buckle function directly into the carrier board structure, eliminating the need for separate adapters. The connection buckle is integrated as part of the carrier board's lower surface structure, allowing direct antenna attachment without additional components, thus reducing overall module size while maintaining ease of connection.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the intermediate adapter component from the signal path. By providing direct antenna pins on the carrier board that connect to the antenna through the integrated connection buckle, the design removes the unnecessary adapter layer, reducing both size and potential signal loss points.

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of operation

If an adapter is used for antenna connection, then the connection is established, but signal loss and impedance mismatches occur

Engineering Contradiction:
Improveantenna connectionVSAvoidsignal transmission
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent removes the adapter component from the signal path entirely. The antenna pins are directly soldered to the carrier board with proper impedance control, and the integrated connection buckle provides direct mechanical and electrical connection to the antenna, eliminating the intermediate connection points that cause signal loss and impedance mismatches.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent implements local quality optimization by designing the antenna connection area with specific impedance-controlled trace routing on the carrier board. The connection buckle and surrounding circuitry are specifically designed to maintain consistent impedance characteristics, ensuring reliable signal transmission without the degradation caused by generic adapter connections.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If the overall circuit structure is made large, then more components can be included, but the module size increases

Engineering Contradiction:
Improvecomponent integrationVSAvoidmodule size
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent applies nesting by placing the wireless microprocessor circuit structure directly on the carrier board, with the antenna connection buckle integrated into the carrier board structure. The RF shield is positioned between the antenna and processor, creating a nested arrangement where components are efficiently layered and space-utilized, maintaining high component integration within a compact footprint.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent merges multiple functions into the carrier board structure itself. The carrier board serves as the mechanical support, the electrical connection substrate, and houses the integrated antenna connection buckle. This consolidation eliminates the need for separate mounting structures and connection adapters, achieving high component integration without increasing module size.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20260052623A1Wireless microprocessor module
Publication Date: 2026.02.19 BANFI SEMICONDUCTOR CO LTD
  • US20260052623A1 patent drawing
  • US20260052623A1 patent drawing
  • US20260052623A1 patent drawing

AI summary

A wireless microprocessor module includes a carrier board, having an upper surface and a lower surface; a wireless microprocessor circuit structure, provided on the upper surface of the carrier board; at least one antenna pin, provided on the lower surface of the carrier board and electrically connected to the wireless microprocessor circuit structure; and an antenna connection buckle, provided on the upper surface of the carrier board and electrically connected to the wireless microprocessor circuit structure and the at least one antenna pin. In this way, the antenna connection buckle is built in the wireless microprocessor module through the antenna pin, and an antenna device may be directly connected thereto. In addition, the wireless microprocessor core of the wireless microprocessor circuit structure may enhance the emitted signals through a front-end chip of the wireless microprocessor circuit structure to avoid serious interference from noises.