Through-Hole Circuit Layout for Bubble-Free Semiconductor Connections
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Solution Overview
Problem
Existing electronic devices face issues with air bubbles forming during conductor formation, leading to poor electrical contact and potential electrical abnormalities, which affect the reliability and display quality.
Innovation Solution
The electronic device incorporates a through hole in the substrate with a first conductive pattern surrounding it, allowing the conductor to partially fill the hole while maintaining a gap, thereby releasing air bubbles and ensuring reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the through hole is completely filled with conductor, then electrical connection is achieved, but air bubbles are trapped causing poor contact and electrical abnormalities
Solution Approach 1:
The patent extracts the harmful air bubbles from the conductor filling process by designing the first conductive pattern to not completely surround the through hole, creating an opening that allows air bubbles to escape during conductor deposition, thus eliminating the harmful factor while maintaining electrical connection
Solution Approach 2:
The first conductive pattern is segmented to partially surround the through hole rather than forming a complete enclosure, dividing the conductive structure into regions that allow air bubble release paths while maintaining sufficient electrical connection
2Reliability
If the first conductive pattern completely surrounds the through hole, then electrical connection is ensured, but air bubbles are trapped during conductor formation
Solution Approach 1:
The patent removes the complete surrounding structure of the first conductive pattern around the through hole, extracting the constraint that causes air bubble trapping, while maintaining sufficient conductive coverage for reliable electrical connection
3Reliability
If electronic components are disposed on the front side of the substrate, then electrical connection is achieved, but the peripheral usage rate is high and narrow frame requirement is not met
Solution Approach 1:
The patent moves electronic components from the front side (two-dimensional plane) to the back side of the substrate, utilizing the third dimension (depth/vertical space) to reduce peripheral usage area on the front side and achieve narrow frame requirements
Data Source
AI summary
An electronic device includes a first semiconductor, a circuit structure and a substrate. The circuit structure has a first conductive layer, a second conductive layer and a first insulating layer between the first conductive layer and the second conductive layer. The first conductive layer has a first conductive pattern. The second conductive layer has a plurality of second conductive patterns. The first conductive pattern is closer to the first semiconductor than the plurality of second conductive patterns. The substrate is disposed between the first semiconductor and the circuit structure. The substrate has a through hole penetrating the substrate and the first semiconductor is electrically connected to the circuit structure through the through hole. In a cross-sectional view of the electronic device, a maximum width of the first conductive pattern is less than a maximum width of one of the plurality of second conductive patterns.