Ceramic Scribe Substrate with Continuous Grooves for Crack-Free Division
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Solution Overview
Problem
Existing ceramic substrates face challenges in efficient division without chipping or cracking, particularly due to their high strength and thinness, which complicates manufacturing and increases the risk of substrate breakage during machining and transportation.
Innovation Solution
A ceramic scribe substrate with a continuous groove and a group of non-continuous grooves formed by laser machining, optimized in depth and spacing, to facilitate controlled division into smaller pieces with reduced mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal plate is used as a scribe substrate, then the substrate can be easily processed by a scribe, but the substrate cannot withstand high temperatures during firing and cannot be etched by fluorocarbon-based plasma
Solution Approach 1:
The substrate is constructed as a composite material comprising a ceramic body (providing heat and plasma resistance) and a metallic layer (providing machinability and conductivity). This composite structure allows the substrate to simultaneously withstand high temperatures during firing and be etched by fluorocarbon-based plasma while maintaining ease of processing by scribe through the metallic layer.
2Reliability
If a ceramic plate is used as a scribe substrate, then the substrate can withstand high temperatures and plasma etching, but the substrate cannot be easily processed by a scribe
Solution Approach 1:
The substrate combines ceramic material (for thermal and plasma resistance) with a metallic layer (for machinability). The metallic layer serves as a sacrificial or protective layer that enables easy scribe processing while the underlying ceramic body provides the necessary resistance to high temperatures and plasma etching conditions.
Solution Approach 2:
The metallic layer acts as an intermediary between the scribe tool and the ceramic body. It provides a surface that is easily machinable by scribe while protecting the ceramic substrate during processing, and subsequently allows the ceramic to withstand high temperature and plasma conditions that the metal alone could not endure.
Data Source
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AI summary
A ceramic scribe substrate according to the present embodiment includes a continuous groove having multiple grooves connected to each other formed by fiber laser irradiation on a surface portion of a scribe line shaping a ceramic substrate. The continuous groove has a depth of more than 50 um within a range of 0.15 times or more and 0.55 times or less a thickness of the ceramic substrate.