Gradient-Filler Sealing Resin for Low-Height Laser-Marked Modules
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Solution Overview
Problem
Conventional modules with inorganic oxide fillers in the sealing resin layer face issues where the marking laser penetrates through the resin, potentially damaging components due to reduced resin thickness, necessitating a solution to reduce height while preventing component damage.
Innovation Solution
A module design with a sealing resin layer containing inorganic oxide filler, where the filler content is lower on the side opposite to the substrate, allowing for reduced thickness without laser penetration, using a layered structure with varying filler content and potentially no filler in specific layers to prevent laser damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the sealing resin layer is reduced to reduce module height, then the height of the module is reduced, but the marking laser passes through the sealing resin layer and may damage the component
Solution Approach 1:
The patent applies local quality by creating a sealing resin layer with non-uniform filler distribution. Specifically, the filler content rate varies through the thickness of the resin layer, with a higher concentration near the component side and lower concentration near the laser entry side. This localized variation in material composition allows the resin layer to simultaneously achieve adequate thickness reduction for compactness while maintaining sufficient laser attenuation to protect the mounted component.
Solution Approach 2:
The patent employs composite materials by combining the sealing resin with inorganic oxide fillers in a gradient distribution. This composite structure allows optimization of both mechanical sealing properties and optical laser attenuation properties. The inorganic oxide fillers serve dual purposes: providing structural reinforcement and creating laser absorption/scattering centers that prevent laser penetration to the component.
2Reliability
If filler is added to the sealing resin layer to prevent laser penetration, then component protection is improved, but the height of the module increases
Solution Approach 1:
The patent resolves this contradiction by implementing local quality through gradient filler distribution. Instead of uniformly thickening the resin layer or using high filler content throughout, the filler concentration is localized primarily in the region where laser attenuation is most needed. This allows achieving adequate laser protection with minimal overall thickness increase, thus preventing component damage while maintaining compact module height.
Solution Approach 2:
The patent applies parameter changes by varying the filler content rate as a continuous parameter through the thickness of the sealing resin layer. Rather than using discrete layers or uniform composition, the filler concentration is adjusted continuously or in steps from one surface to the other, optimizing the balance between laser attenuation efficiency and structural thickness. This parameter optimization enables reduced module height while maintaining component protection.
3Reliability
If the filler content rate is increased in the sealing resin layer, then laser attenuation is improved, but the transparency of the marking portion is reduced
Solution Approach 1:
The patent applies local quality by spatially differentiating the filler distribution within the sealing resin layer. The filler content rate is made non-uniform, with higher concentrations positioned to optimize laser attenuation while lower concentrations are maintained in regions where marking visibility and transparency are required. This localized optimization allows simultaneous achievement of laser protection and marking portion transparency.
Solution Approach 2:
The patent resolves the contradiction by transitioning from a two-dimensional uniform filler distribution to a three-dimensional gradient distribution. By utilizing the thickness dimension of the resin layer, the filler content rate varies through the depth, allowing laser attenuation to be achieved primarily in the laser propagation path while maintaining transparency in the marking display region. This dimensional approach enables independent optimization of both laser attenuation and optical transparency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces module height while preventing component damage from marking lasers, maintaining component visibility and enhancing electromagnetic interference shielding.
Implementation Method 1
when the filler is added to the sealing resin layer while a thickness of the sealing resin layer is reduced in order to reduce a height of the module, sometimes the marking laser applied to the sealing resin layer passes through the sealing resin layer through the filler
Implementation Method 2
the marking laser applied to the sealing resin layer passes through the sealing resin layer through the filler
Data Source
AI summary
A module includes a substrate, a first component, and a first sealing resin layer. The substrate includes a first principal surface. The first component is mounted on the first principal surface. The first sealing resin layer contains a filler containing an inorganic oxide as a main component. The first sealing resin layer is provided on the first principal surface. The first sealing resin layer seals the first component. A marking portion is provided on a surface of the first sealing resin layer on a side opposite to the substrate. In the first sealing resin layer, the content rate of the filler is smaller in a second portion on the side opposite to the substrate than in a first portion on the substrate.