Busbar Layout With Heat Sinks for PCB Thermal Reliability
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Solution Overview
Problem
Circuit devices face challenges in achieving downsizing while maintaining the reliability of the circuit board due to heat generated by semiconductor switching elements, which can degrade the board's performance.
Innovation Solution
The circuit device incorporates a configuration where electronic components are mounted on facing parts of busbars, with heat dissipation members connected to these busbars to transfer and release heat externally, and the circuit board is positioned to avoid direct exposure to heat, enhancing heat dissipation and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board is disposed above the semiconductor switching element to achieve downsizing, then the device size is reduced, but the circuit board is susceptible to heat generated by the semiconductor switching element, decreasing reliability
Solution Approach 1:
The patent positions the circuit board in a staggered arrangement relative to the semiconductor switching element, utilizing the third dimension (depth/length direction) rather than simply stacking components vertically. The circuit board is positioned such that its wiring board area is located behind the first facing part and in front of the second facing part, creating a spatial offset that reduces thermal exposure while maintaining compact overall dimensions.
Solution Approach 2:
The busbar structure serves as an intermediary element between the semiconductor switching element and the circuit board. The first busbar with its facing parts creates a thermal barrier and spatial buffer zone, allowing the circuit board to be electrically connected while physically positioned away from the primary heat source, thus mediating the thermal interaction between these components.
2Reliability
If heat dissipation members are added to manage thermal stress, then reliability is improved, but device complexity increases
Solution Approach 1:
The busbar structure performs multiple functions simultaneously: it provides electrical connection, structural support, and thermal management. The first busbar with its facing parts not only connects the semiconductor switching element to the circuit board electrically but also creates a thermal barrier and defines the spatial arrangement, eliminating the need for separate dedicated heat dissipation structures.
Solution Approach 2:
The patent merges the electrical connection function and heat dissipation function into a single integrated busbar structure. The first busbar and second busbar are positioned to face each other, creating a thermal management system that is combined with the electrical connection system, thereby reducing overall device complexity while achieving both objectives.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for downsizing of the circuit device while improving the reliability of the circuit board by effectively managing heat, thus maintaining performance and reducing thermal stress on the board.
Implementation Method 1
a first heat dissipation member that is thermally connected to the first busbar; a second heat dissipation member that is thermally connected to the second busbar
Implementation Method 2
heat dissipation members connected to these busbars to transfer and release heat externally
Data Source
AI summary
A first heat dissipation member is thermally connected to a first busbar. A second heat dissipation member is thermally connected to a second busbar. The first busbar and the second busbar respectively have a first facing part and a second facing part that face each other. The first facing part has a first surface on which a first electronic component is mounted and a second surface opposite to the first surface. The second facing part has a third surface that faces the second surface and a fourth surface that is positioned opposite to the third surface and on which a second electronic component is mounted. A circuit board has a wiring board that is positioned behind the first facing part and is positioned in front of the second facing part when the second facing part side is seen from the first facing part side.