PCB Edge-Enabled Void Layout for Compact Multi-Antenna Integration
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Solution Overview
Problem
The increasing number of components in wireless devices, particularly antennas, requires efficient spatial separation without increasing the device's footprint, which is challenging due to compact form factors.
Innovation Solution
The implementation of edge-enabled void constructions (EEVC) on printed circuit boards, which include conductive planes with voids and switches, allowing for antennas to be integrated without increasing the device's size by altering the current path through selective switching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas are added to wireless devices to enable MIMO and beamforming, then communication capabilities are improved, but device footprint increases
Solution Approach 1:
The patent utilizes the third dimension (vertical depth) by creating void constructions within the PCB substrate. Instead of placing antennas side-by-side on the same plane, the invention carves out voids that extend into the substrate depth, allowing antenna elements to be positioned in three-dimensional space. This dimensional transition enables multiple antennas to coexist without increasing the device's planar footprint.
Solution Approach 2:
The patent embeds antenna structures within void constructions that are nested inside the PCB substrate. The antenna elements are positioned within the voids, effectively nesting the antenna functionality within the existing PCB structure. This nesting approach allows multiple antennas to be integrated without requiring additional external space.
2Reliability
If spatial separation between antennas is increased to reduce interference, then antenna performance is improved, but device compactness deteriorates
Solution Approach 1:
The patent achieves spatial separation by transitioning from two-dimensional planar arrangement to three-dimensional positioning. Antenna elements are separated along the vertical axis by positioning them at different depths within the substrate voids, while maintaining compact planar dimensions. This vertical separation reduces electromagnetic interference without compromising device compactness.
3Ease of manufacture
If conventional antenna designs are used, then manufacturing simplicity is maintained, but integration density decreases
Solution Approach 1:
The patent segments the PCB substrate by creating void constructions that divide the substrate into distinct regions. These voids are formed by removing material in specific patterns, creating separate compartments for different antenna elements. The segmentation is achieved through standard PCB fabrication processes, maintaining manufacturing simplicity while enabling high integration density.
Solution Approach 2:
The antenna structures are nested within the void constructions of the PCB substrate. This nesting is achieved by forming voids that accommodate the antenna elements, allowing multiple antennas to be integrated within the existing PCB footprint without requiring complex assembly processes.
Data Source
AI summary
In some embodiments, a printed circuit board is disclosed. The printed circuit board includes a substrate, a conductive plane, and at least one switch. The conductive plane includes an edge enabled void construction (EEVC) along a geometric perimeter of the conductive plane, the EEVC having an EEVC void that defines an EEVC perimeter that extends into the conductive plane.