Ag Composite Member Interface Control for High-Temperature Adhesion
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Solution Overview
Problem
Existing composite members with metal layers face issues of blistering, separation, or disappearance when exposed to high temperatures due to the melting of eutectic alloys, compromising their heat resistance and conductivity.
Innovation Solution
A composite member with a substrate composed of a non-metal phase and a metal phase, where the metal layer is mainly composed of Ag, and the Cu content in the boundary region with the substrate is limited to less than or equal to 20 atomic %, preventing the formation of eutectic alloys and ensuring adhesion through elements like Ti, Cr, V, Nb, Zr, and Ta, with a smooth metal layer surface and controlled thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal layer is applied on a substrate to improve heat resistance, then heat conductivity is improved, but at high temperatures the metal layer blisters, separates, or disappears due to eutectic alloy melting
Solution Approach 1:
The patent changes the compositional parameters by strictly limiting Cu content in the boundary region to ≤20 atomic % and controlling the metal layer composition (Ag ≥70 atomic %, Cu ≤30 atomic %). This parameter control prevents eutectic alloy formation while maintaining heat conductivity, resolving the contradiction between heat resistance and metal layer stability at high temperatures
Solution Approach 2:
The patent applies different compositional requirements to different regions: the boundary region has Cu ≤20 atomic % to prevent eutectic formation, while the metal layer can have up to Cu ≤30 atomic %. This local quality differentiation allows the metal layer to maintain good adhesion and heat conductivity without suffering from eutectic melting at the critical substrate interface
2Strength
If Cu is added to the metal layer to improve adhesion, then bonding strength is improved, but eutectic alloys form at high temperatures causing blistering and separation
Solution Approach 1:
The patent changes the Cu concentration parameter from unrestricted to strictly controlled (≤20 atomic % in boundary region, ≤30 atomic % in metal layer). This parameter modification maintains sufficient adhesion strength while preventing eutectic alloy formation that causes blistering and separation at high temperatures
Solution Approach 2:
The patent converts the potentially harmful effect of Cu (which can form brittle eutectic alloys) into a beneficial element by carefully controlling its content. The limited Cu addition improves adhesion and electrical conductivity without reaching the threshold for harmful eutectic formation, thus converting a harmful factor into a beneficial one
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite member maintains excellent heat resistance and conductivity even at high temperatures, preventing blistering and separation of the metal layer, and ensuring effective heat transfer.
Implementation Method 1
ensuring adhesion through elements like Ti, Cr, V, Nb, Zr, and Ta
Implementation Method 2
maintains excellent heat resistance and conductivity even at high temperatures, preventing blistering and separation of the metal layer, and ensuring effective heat transfer
Data Source
AI summary
A composite member having an excellent heat resistance is provided. The composite member includes: a substrate composed of a composite material including a non-metal phase and a metal phase; and a metal layer that covers at least a portion of a surface of the substrate, wherein a metal included in each of the metal phase and the metal layer is mainly composed of Ag, and a ratio of a content of Cu to a total content of Ag and Cu in a boundary region of the metal layer with the substrate is less than or equal to 20 atomic %.