RF Module Through-Hole Component Layout for Lower Profile
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Solution Overview
Problem
There is an increasing demand to further reduce the height of radio frequency (RF) modules, which existing technologies have not adequately addressed.
Innovation Solution
The RF module design incorporates a wiring board with a core board and multiple buildup layers, where at least one electronic component is partially housed inside the core board's through hole, allowing for a more compact configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic components are mounted on the surface of the core board, then ease of assembly is improved, but the height of the RF module increases
Solution Approach 1:
The patent places electronic components inside the through-holes of the core board, effectively nesting components within the board structure rather than mounting them on the surface. This nesting approach reduces the overall height of the RF module while maintaining assembly feasibility through automated insertion processes
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional internal placement by utilizing the vertical dimension of the through-holes. Components are positioned within the thickness of the board, transforming the assembly space from a surface plane to an internal volume, thereby reducing the module's external height
2Ease of operation
If wire connections between components are lengthened, then ease of connection is improved, but noise immunity deteriorates
Solution Approach 1:
The patent extracts the wire connections from the conventional long external routing and replaces them with direct internal connections through the board substrate. By taking out the unnecessary wire length and using direct traces or vias within the board, the connection becomes both easier and more immune to noise
Solution Approach 2:
The core board itself acts as an intermediary medium that provides direct electrical connection paths between components. Instead of using external wires as mediators, the board's internal conductive structures serve as the connection medium, reducing connection length and improving noise immunity
3Length of stationary object
If electronic components are placed inside the through hole, then the height and area of the RF module are reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary action by pre-drilling and plating the through-holes in the core board before component insertion. This preliminary preparation of the board structure simplifies the subsequent component placement process and enables automated manufacturing, reducing overall manufacturing complexity despite the three-dimensional component placement
Data Source
AI summary
A radio frequency module includes a wiring board, a first electronic component and a second electronic component, and a third electronic component connected to a matching circuit. The wiring board includes a core board having not only a first principal surface and a second principal surface but also a through hole, a first buildup layer stacked on the first principal surface, and a second buildup layer stacked on the second principal surface. At least one of the first electronic component or the second electronic component is disposed partially inside the through hole. The third electronic component is disposed on the first buildup layer. The second electronic component is stacked on one side, where the third electronic component is located, of the first electronic component in a thickness direction defined for the core board. The second electronic component is a constituent component of the matching circuit.