Semiconductor Mounting Substrate With Corrosion-Resistant Barrier Layer
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Solution Overview
Problem
Conventional semiconductor element mounting substrates face issues with base corrosion, particularly when exposed to salt water, which affects their durability and production efficiency.
Innovation Solution
A semiconductor element mounting substrate with a protective layer made of a more corrosion-resistant material, such as nickel, is interposed between the base and the electrode, covering key surfaces to prevent corrosion and ensure effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal base is used for heat dissipation, then heat dissipation performance is improved, but corrosion resistance deteriorates when exposed to salt water
Solution Approach 1:
The patent uses a composite structure combining a metal base (for heat dissipation) with a protective layer of corrosion-resistant material (such as ceramic or polymer). This composite material approach allows the substrate to simultaneously achieve both heat dissipation performance and corrosion resistance, resolving the contradiction between these two requirements.
Solution Approach 2:
The protective layer acts as an intermediary between the metal base and the corrosive salt water environment. It mediates the interaction by providing a barrier that prevents direct contact between the metal and corrosive agents, while still allowing the metal base to perform its heat dissipation function.
2Reliability
If a protective layer is added to prevent corrosion, then corrosion resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes the thickness parameter of the protective layer to be sufficiently thin to minimize manufacturing complexity and cost, while still maintaining adequate corrosion protection. By carefully controlling this parameter, the patent achieves corrosion resistance without excessive complexity.
Solution Approach 2:
The protective layer is applied selectively to specific areas of the metal base where corrosion protection is most needed, rather than uniformly across the entire substrate. This local application approach reduces manufacturing complexity and material costs while still providing effective corrosion protection at critical locations.
3Reliability
If the protective layer thickness is increased to improve corrosion protection, then corrosion resistance is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent optimizes the thickness parameter of the protective layer to find the optimal balance between corrosion protection and heat dissipation. By controlling the thickness within a specific range, the patent ensures that the protective layer provides adequate corrosion resistance while maintaining sufficient thermal conductivity for effective heat dissipation.
Solution Approach 2:
The patent employs a thin film protective layer that is sufficiently thin to allow heat to pass through while providing adequate corrosion protection. This thin film approach enables the substrate to maintain its heat dissipation performance while gaining corrosion resistance, resolving the contradiction between these two requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer effectively prevents base corrosion, reduces production costs, and maintains heat dissipation performance, while enhancing the substrate's durability and adhesion of layers.
Implementation Method 1
a protective layer disposed between the base and the electrode and formed of a material that is more corrosion resistant than the metal forming the base
Implementation Method 2
a contact layer that is disposed between the insulating layer and the protective layer and is in close contact with both the insulating layer and the protective layer
Implementation Method 3
When the semiconductor element mounting substrate having the structure described above is used as a heat dissipation substrate for dissipating heat generated in the semiconductor element
Data Source
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AI summary
A semiconductor element mounting substrate includes a base formed of a metal, an electrode to be connected to a semiconductor element, and a protective layer disposed between the base and the electrode and formed of a material that is more corrosion resistant than the metal forming the base.