Embedded Organic Interposer Layout for Lower RC High-Bandwidth Routing
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Solution Overview
Problem
Conventional interposers face limitations in bandwidth due to thin conductive lines with high resistance and capacitance, leading to restricted transmission capacity and cost inefficiencies, especially in highly integrated microelectronic packages.
Innovation Solution
Embedded organic interposers with thicker conductors and additional routing layers, embedded within the core of the package, to reduce resistive-capacitive (RC) load and enhance transmission capacity up to 20-60 GHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional thin conductive lines are used to increase integration density, then the number of conductors per unit area increases, but the resistive-capacitive load increases and transmission bandwidth decreases
Solution Approach 1:
The patent changes the physical parameters of the conductors by making them three-dimensional vertical structures instead of thin planar lines. This transforms the conductor geometry from 2D to 3D, increasing the effective conductor cross-section and reducing RC load while maintaining high conductor density through vertical stacking.
Solution Approach 2:
The patent introduces a vertical dimension to the conductor layout by creating three-dimensional conductive structures that extend through multiple layers. This dimensional transition allows more conductors to be packed in a given footprint while each conductor maintains sufficient cross-sectional area for low RC load transmission.
2Area of stationary object
If thin conductive lines are used to achieve miniaturization, then the package footprint decreases, but the effective length of transmission routes is limited due to RC constraints
Solution Approach 1:
By transitioning from planar to vertical three-dimensional conductors, the patent enables longer transmission routes to be accommodated within the same footprint. The vertical stacking allows signals to traverse multiple conductor segments in series, effectively increasing the usable transmission length without expanding the package area.
3Ease of manufacture
If conventional interposers are used to provide routing layers, then the structure is simpler to manufacture, but the bandwidth is limited due to RC load and the number of routing layers is restricted
Solution Approach 1:
The patent changes the conductor geometry parameter from thin planar lines to thick vertical three-dimensional structures. This parameter change reduces the RC load of each conductor, enabling higher bandwidth operation and allowing more routing layers to be effectively utilized without being constrained by RC limitations.
4Adaptability or versatility
If fine pitch routes are implemented across multiple layers to accommodate routing needs, then the routing capacity increases, but the cost increases due to minimum rule sets applying to entire surfaces
Solution Approach 1:
The patent segments the conductor structure into modular vertical units that can be independently formed and configured. This segmentation allows fine pitch routing to be implemented only where needed rather than across entire surfaces, reducing the impact of minimum rule sets and improving cost effectiveness while maintaining high routing capacity.
Data Source
AI summary
Embedded organic interposers for high bandwidth are provided. Example embedded organic interposers provide thick conductors with more dielectric space, and more routing layers of such conductors than conventional interposers, in order to provide high bandwidth transmission capacity over longer spans. The embedded organic interposers provide high bandwidth transmission paths between components such as HBM, HBM2, and HBM3 memory stacks, and other components. To provide the thick conductors and more routing layers for greater transmission capacity, extra space is achieved by embedding the organic interposers in the core of the package. Example embedded organic interposers lower a resistive-capacitive (RC) load of the routing layers to provide an improved data transfer rate of 1 gigabits per second over at least a 6 mm span, for example. The embedded interposers are not limited to use with memory modules.