Dual-Sided RF Module Packaging With Through-Mold LGA Connections
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Solution Overview
Problem
Existing radio-frequency (RF) module packaging technologies face challenges in efficiently integrating components and providing effective RF shielding while allowing for mounting on circuit boards using a land grid array (LGA) configuration.
Innovation Solution
A dual-sided RF module packaging substrate with through-mold connections, including signal pins and ground pins, is designed to accommodate components on both sides, with optional shielding features and overmold structures for encapsulation, allowing for efficient integration and LGA mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components are integrated on both sides of the packaging substrate, then device functionality and performance are improved, but manufacturing complexity increases
Solution Approach 1:
The packaging substrate is divided into two functional sides: a first side for mounting active RF components (such as amplifiers and switches) and a second side for mounting passive components (such as filters and resonators). This segmentation allows each side to be optimized for its specific component type while maintaining a unified package structure, thereby improving device functionality without overwhelming manufacturing complexity
Solution Approach 2:
The patent transitions from traditional single-sided component mounting to dual-sided component integration by utilizing the third dimension (z-axis) through vertical stacking and through-mold connections. This dimensional change enables doubled component capacity and enhanced RF performance while managing complexity through systematic design of connection architectures
2Adaptability or versatility
If through-mold connections are implemented on the second side, then LGA mounting capability is improved, but signal interference increases
Solution Approach 1:
An overmold structure is introduced as an intermediary element that encapsulates the through-mold connections on the second side. This overmold acts as a shielding barrier between the passive components and the LGA mounting interface, blocking RF signal interference while preserving the electrical connectivity required for LGA mounting capability
Solution Approach 2:
The packaging substrate employs differentiated local qualities: the first side uses a configuration optimized for active components with direct connections, while the second side implements through-mold connections with overmold encapsulation specifically in areas where passive components are mounted. This localized differentiation allows LGA mounting capability to be achieved without compromising RF signal integrity in sensitive areas
3Reliability
If overmold structure is used for encapsulation, then component protection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The encapsulation is segmented into two distinct overmold structures: a first overmold encapsulating components on the first side and a second overmold encapsulating components and through-mold connections on the second side. This segmentation allows each overmold to be designed and manufactured with precision requirements tailored to its specific encapsulation needs, rather than requiring uniform high precision across the entire package
Data Source
AI summary
In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and implementing a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.