Connector Ground Pad Layout for Low-Loss High-Frequency Transmission
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Solution Overview
Problem
Existing high-frequency signal transmission devices, including connectors and wiring boards, suffer from suboptimal high-frequency signal transmission characteristics due to inadequate grounding and contact terminal configurations, leading to issues like ripple, return-loss, and insertion loss.
Innovation Solution
A high-frequency signal transmission device with a connector and wiring board design that includes a contact terminal group with signal and ground contact terminals supported by an insulator, where ground contact terminals have an arm portion abutting against ground contact pads, and ground layers are connected via penetrating electrodes, forming unit arrays to stabilize ground potential and reduce ripple and insertion loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground contact terminals are simply contacted with ground contact pads, then the connector and wiring board can be electrically connected, but high-frequency signal transmission characteristics deteriorate due to inadequate grounding and contact terminal configurations
Solution Approach 1:
The ground contact terminal is divided into multiple functional portions: a contact portion for electrical connection, an arm portion for positioning, and a bent portion for mechanical stability. This segmentation allows each portion to be optimized for its specific function, improving overall grounding effectiveness without excessive complexity
Solution Approach 2:
The arm portion is pre-configured with a specific shape and bending characteristics before assembly. This preliminary action ensures that when the connector is assembled to the wiring board, the ground contact terminal automatically assumes the correct position and orientation, achieving reliable high-frequency signal transmission without requiring complex post-assembly adjustments
2Reliability
If ground contact terminals are positioned to abut against ground contact pads, then grounding is improved, but manufacturing precision requirements increase due to the need for accurate positioning
Solution Approach 1:
The ground contact terminal incorporates an elastic arm portion that can flexibly adjust its position. This dynamic characteristic allows the contact portion to self-align with the ground contact pad during assembly, reducing the stringency of manufacturing precision requirements while maintaining reliable electrical connection
Solution Approach 2:
The arm portion is designed with specific elastic modulus and geometric parameters that allow it to flex within a controlled range. By optimizing these parameters, the terminal can accommodate manufacturing tolerances and positioning variations while still achieving effective grounding contact at the interface
3Object-affected harmful factors
If unit arrays are formed with signal and ground contact terminals, then electromagnetic interference is reduced, but device complexity increases due to the structured arrangement
Solution Approach 1:
Signal contact terminals and ground contact terminals are merged into a unified unit array structure where they are alternately arranged. This integration allows both signal and grounding functions to be achieved simultaneously within a single organized framework, reducing electromagnetic interference through proper spacing and grounding proximity without requiring separate complex structures for each function
Solution Approach 2:
The unit array structure serves multiple functions: it provides organized electrical connections for both signal and ground terminals, establishes proper electromagnetic shielding through alternating arrangement, and simplifies the overall connector design by using a repeatable modular pattern that can accommodate different numbers of signal pairs
Data Source
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AI summary
The present disclosure relates to a high-frequency signal transmission device, and an electrical connection method for a wiring board and a connector. According to an embodiment, high-frequency signal transmission device (1) includes a connector (4) and a wiring board (2). A contact portion (b3) of an arm portion (42b) is positioned so as to (i) at least partially abut against a surface of a covering portion (58) of a ground contact pad (P2) covering the first penetrating electrode (28) directly above a first penetrating electrode (28), or (ii) abut against the ground contact pad (P2) near an outer periphery of the covering portion (58), when the wiring board (2) is electrically connected to the connector (4).