3D High-Frequency Line Pin Structure for Crosstalk Control
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Solution Overview
Problem
Existing high-frequency line structures face crosstalk issues due to miniaturization, which impedes stable propagation of high-frequency signals beyond 70 GHz, and lack impedance matching configurations to address these challenges.
Innovation Solution
A high-frequency line structure with signal lead pins springing up from a horizontal plane and grounded by thicker ground lead pins, integrated through a comb-shaped lead frame arrangement and precise positioning, ensuring minimal gaps and controlled adhesion, using materials with matching thermal expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pitch of high-frequency lines is reduced to accommodate miniaturized optoelectronic components, then component density increases, but crosstalk between adjacent high-frequency lines becomes apparent
Solution Approach 1:
The patent introduces a three-dimensional lead pin structure where signal lead pins spring up vertically from the horizontal plane of ground lead pins. This vertical dimension creates spatial separation between signal paths while maintaining compact horizontal footprint, thereby reducing crosstalk between adjacent high-frequency lines despite reduced pitch
Solution Approach 2:
The patent applies different structural characteristics to different parts of the lead pin assembly: ground lead pins have larger cross-sectional areas for shielding, while signal lead pins have smaller cross-sectional areas and spring-up structures for impedance control. This localized differentiation optimizes each component's function to simultaneously achieve high density and low crosstalk
2Volume of moving object
If miniaturization of optoelectronic components is pursued, then device size decreases, but crosstalk problems between adjacent high-frequency lines become apparent
Solution Approach 1:
By transitioning from a two-dimensional planar arrangement to a three-dimensional structure with vertically springing signal lead pins, the patent achieves compact horizontal dimensions while creating vertical separation that reduces electromagnetic coupling and crosstalk between adjacent lines
Solution Approach 2:
The patent segments the lead pin structure into distinct ground lead pins and signal lead pins with different geometries and orientations. This segmentation allows independent optimization of each type: ground pins provide shielding while springing signal pins maintain controlled impedance, achieving miniaturization without compromising signal integrity
3Reliability
If signal lead pins are arranged between ground lead pins, then impedance matching is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates spring-up structures in the signal lead pins that automatically position themselves during assembly. This preliminary structural design pre-establishes the correct spatial relationship between signal and ground lead pins, reducing the actual positioning precision required during manufacturing while ensuring proper impedance matching
Data Source
AI summary
A high-frequency line structure includes: a high-frequency line substrate; ground lead pins fixed to ground ends provided in a bottom surface of the high-frequency line substrate; and signal lead pins fixed to signal line ends provided in the bottom surface of the high-frequency line substrate, wherein the signal lead pins are arranged between the ground lead pins, the signal lead pins have a structure in which each of the signal lead pins springs up in a direction toward a side on which the high-frequency line substrate is arranged, from a horizontal plane to which bottom surfaces of the ground lead pins pertains, and spring-up heights in the structure in which the respective signal lead pins spring up are substantially the same.