Flexible Circuit Board Layout for Low-Radiation Signal Transmission

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Solution Overview

Problem

Existing circuit boards experience radiation issues due to differences in propagation modes between strip-line and micro-strip-line sections, leading to reflection of high-frequency signals and generation of standing waves when bent, which can cause radiation emission.

Innovation Solution

A circuit board design featuring a first line-shaped reference conductor layer that meanders and overlaps with a signal conductor layer, with alternating projecting portions to minimize radiation by adjusting overlapping regions and maintaining consistent impedance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the circuit board is designed with strip-line sections and micro-strip-line sections to enable bending, then the circuit board can be bent, but reflection of high-frequency signals occurs at the boundaries between different propagation mode sections

Engineering Contradiction:
Improvebending capabilityVSAvoidsignal reflection
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by making the reference conductor layer meander only in specific regions (micro-strip-line sections) where bending is needed, while maintaining a straight configuration in strip-line sections. This localized meandering allows the circuit board to be bent in specific areas without causing signal reflection at boundaries, as the meandering portions are designed to accommodate mechanical deformation while maintaining electrical continuity and impedance control.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies dynamics by designing the reference conductor layer with a meandering shape that can dynamically adapt to mechanical bending. The meandering portions allow the conductor to expand and contract in the front-back direction when the circuit board is bent, maintaining electrical performance while accommodating mechanical deformation. This dynamic structure prevents signal reflection by ensuring smooth transitions during bending operations.

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If the micro-strip-line section is made sufficiently long to allow bending, then the circuit board can be bent, but standing waves are generated in the signal line conductor due to signal reflection

Engineering Contradiction:
Improvebending capabilityVSAvoidsignal integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies local quality by confining the meandering structure to specific micro-strip-line sections where bending is required, while maintaining straight reference conductors in strip-line sections. This localized approach allows bending capability in necessary regions while preventing standing waves in signal-critical areas, thereby maintaining signal integrity without compromising bending adaptability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies dynamics through the meandering reference conductor layer that can dynamically adjust to bending forces. The meandering portions absorb mechanical stress and allow the structure to flex without causing signal reflections that would lead to standing waves, thus maintaining signal integrity while enabling bending capability.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If the reference conductor layer is made meandering to reduce breakage during bending, then the circuit board can be bent, but the structure becomes more complex

Engineering Contradiction:
Improvebending capabilityVSAvoidconductor layer structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by implementing meandering only in the reference conductor layer within micro-strip-line sections where bending occurs, while keeping the signal conductor layer and reference conductors in strip-line sections straight. This localized meandering reduces structural complexity compared to making the entire conductor system meandering, while still providing the necessary bending capability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies dynamics through the meandering reference conductor layer that provides flexible adaptation to bending forces. This dynamic structure allows the circuit board to be bent without breaking conductors, and the meandering is confined to necessary regions, maintaining reasonable structural complexity while achieving bending capability.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12439508B2Circuit board
Publication Date: 2025.10.07 MURATA MFG CO LTD
  • US12439508B2 patent drawing
  • US12439508B2 patent drawing
  • US12439508B2 patent drawing

AI summary

When viewed in an up-down direction, a first line-shaped reference conductor layer extends along a first signal conductor layer such that portions thereof overlap. When viewed in the up-down direction, the first line-shaped reference conductor layer meanders such that one or more first projecting portions projecting from the first signal conductor layer in a first orthogonal direction and one or more second projecting portions projecting from the first signal conductor layer in a second orthogonal direction alternate in a transmission direction. A section of at least one or more first pairs of projecting portions excluding both ends thereof is not connected to a conductor layer other than one or more of the one or more first projecting portions and one or more of the one or more second projecting portions included in the at least one or more first pairs of projecting portions.