Interposer Package Layout for Compact Reliable Component Connections
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Solution Overview
Problem
Conventional approaches for forming component carrier-type packages face challenges in achieving compactness and reliability, particularly in connecting components with small spacing and ensuring mechanical robustness and electrical reliability under harsh conditions.
Innovation Solution
A package design comprising a component carrier, an interposer with laminated electrically conductive vertical through connections and horizontal structures in a dielectric matrix, and components directly connected to exposed horizontal structures of the interposer, eliminating the need for vertical through connections and allowing for a compact, reliable, and mechanically robust package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional approaches are used to form component carrier-type packages, then connections between components can be established, but the package size becomes larger and mechanical robustness is reduced
Solution Approach 1:
The patent transitions from conventional vertical stacking with through connections to a planar configuration where components are connected via horizontal structures on the interposer surface. This dimensional change eliminates the need for vertical through connections, reducing package height and improving mechanical robustness while maintaining electrical connectivity.
Solution Approach 2:
The patent extracts and eliminates the vertical through connections from the interposer structure, retaining only the essential horizontal conductive structures needed for electrical connection. This simplification reduces structural complexity and improves mechanical reliability while achieving compact packaging.
2Adaptability or versatility
If components with small spacing are used to increase functionality, then product functionality increases, but manufacturing precision requirements increase
Solution Approach 1:
The interposer acts as an intermediary between the component carrier and components, providing a standardized platform with pre-defined horizontal conductive structures. This intermediary layer simplifies the connection process for closely spaced components, reducing manufacturing precision requirements while enabling high-density component arrangements for enhanced functionality.
Solution Approach 2:
The patent segments the package into distinct functional layers: the component carrier, the interposer with horizontal structures, and the components. This segmentation allows each layer to be optimized independently, facilitating precise component placement on the interposer while maintaining overall package flexibility and functionality.
3Reliability
If vertical through connections are used in the interposer, then electrical connections can be established, but the package becomes less compact and mechanically weaker
Solution Approach 1:
The patent replaces vertical through connections with horizontal conductive structures on the interposer surface. This dimensional shift maintains electrical connectivity between components while eliminating the vertical depth required for through connections, resulting in a more compact package with improved mechanical strength.
Solution Approach 2:
The patent extracts the essential electrical connection function from the vertical through connections and implements it through horizontal conductive structures. This elimination of vertical through connections reduces package volume and improves mechanical robustness while preserving electrical connectivity.
Data Source
AI summary
A package with a component carrier, an interposer and a component and a method of manufacturing the same. The package includes a component carrier, an interposer arranged on the component carrier having a laminated interposer stack with electrically conductive vertical through connections and electrically conductive horizontal structures in a dielectric matrix, and at least one component arranged on the interposer. At least one of the component carrier and the at least one component is directly connected to exposed horizontal structures of the interposer.