Bracket-Free LED Encapsulation Structure for Thin, Adhesive Packages
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Solution Overview
Problem
Existing LED light-emitting devices are bulky and costly due to the use of LED brackets, which increase thickness and manufacturing costs, and existing encapsulation materials lack sufficient adhesion, leading to detachment issues.
Innovation Solution
A light-emitting device comprising a substrate with light-emitting chips and an encapsulation layer that allows light emission, eliminating the need for brackets and enhancing adhesion through fixing grooves in the encapsulation layer to improve bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LED brackets are used to meet sealing requirements, then sealing performance is improved, but device thickness and cost increase
Solution Approach 1:
The patent extracts and removes the LED bracket component from the traditional LED lamp structure. By directly mounting LED chips on the circuit board without brackets, the design eliminates the thickness contribution of brackets while maintaining sealing performance through alternative means (sealing adhesive layers and encapsulation structures).
Solution Approach 2:
The patent merges the functions of the bracket and sealing structures into integrated sealing adhesive layers and encapsulation structures. The sealing adhesive layer serves both as an adhesive to hold components and as a sealing barrier, eliminating the need for separate bracket structures while achieving both mechanical support and sealing functions.
2Reliability
If LED brackets are used to meet sealing requirements, then sealing performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent removes the LED bracket component, reducing the number of parts that need to be manufactured, stored, and assembled. This simplification directly reduces manufacturing costs while the sealing function is achieved through the sealing adhesive layer and encapsulation structures.
Solution Approach 2:
The patent combines multiple functions into fewer components. The sealing adhesive layer simultaneously provides adhesion, sealing, and protection functions that were previously distributed across brackets and separate sealing components, reducing overall manufacturing complexity and cost.
3Illumination intensity
If conventional encapsulation materials are used, then light transmission is achieved, but adhesion strength is insufficient causing detachment
Solution Approach 1:
The patent employs composite encapsulation structures combining multiple materials with complementary properties. The encapsulation layer integrates materials that provide both excellent light transmission characteristics and strong adhesion to the substrate and LED chips, preventing detachment while maintaining optical performance.
Solution Approach 2:
The patent modifies the chemical and physical parameters of the encapsulation materials to enhance adhesion strength. By adjusting composition ratios, crosslinking density, and surface treatment parameters, the encapsulation layer achieves both high light transmission and strong bonding strength to prevent detachment.
Data Source
AI summary
This application relates to a light-emitting device and a manufacturing method thereof, comprising a substrate, a plurality of light-emitting chips arranged on the front side of the substrate, and an encapsulation layer disposed on the substrate to cover each light-emitting chip. The encapsulation layer allows light emitted by the LED chips to pass through.