3D Circuit Board Printing With Optical Positioning and Substrate Control
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Solution Overview
Problem
Current methods for constructing multi-layered electronic circuits and components are inefficient, requiring manual or automated pick and place techniques, and lack precision and integration of structural elements during fabrication.
Innovation Solution
A print head apparatus with optical positioning sensors, capable of vibrating, heating, and cooling substrates, is used to construct multi-layered electronic circuits and components simultaneously, incorporating a gas removal and air filtration system, and enabling 3D printing of color-changing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual or automated pick and place techniques are used to construct multi-layered electronic circuits, then components can be assembled, but the process is inefficient and lacks precision
Solution Approach 1:
The patent merges the construction of electronic circuits and structural elements into a single 3D printing process. The print head deposits conductive materials, insulators, and structural materials simultaneously in one integrated fabrication system, eliminating the need for separate pick-and-place operations and achieving both high efficiency and precision through digital control of material deposition.
Solution Approach 2:
The patent replaces mechanical pick-and-place systems with a digital 3D printing system that uses computer-controlled material deposition. The optical positioning sensor provides precise location feedback, and the system uses digital modeling to guide the print head in depositing materials layer by layer, substituting mechanical assembly with a more precise and efficient additive manufacturing process.
2Ease of manufacture
If structural elements are constructed separately from electronic circuits, then assembly is simplified, but integration and efficiency are reduced
Solution Approach 1:
The patent combines the fabrication of electronic circuits and structural elements into a single unified process. The print head can switch between depositing conductive materials for circuits and structural materials for mechanical components, creating both simultaneously in one integrated fabrication operation, thereby improving productivity without sacrificing ease of manufacture.
Solution Approach 2:
The print head apparatus is designed with multi-functionality, capable of depositing multiple material types (conductive, insulating, structural) and performing both circuit fabrication and structural element construction. This universal tool replaces multiple specialized devices, enabling integrated fabrication while maintaining process simplicity through software control.
3Productivity
If rapid fabrication is achieved through 3D printing, then productivity increases, but precision and control of construction elements may be compromised
Solution Approach 1:
The patent incorporates an optical positioning sensor that provides real-time feedback on the print head position and deposited material placement. This feedback loop allows the system to maintain high fabrication speed while continuously monitoring and correcting positioning accuracy, ensuring precise construction of electronic circuits and structural elements even during rapid 3D printing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and precise fabrication of electronic components, including those containing liquids, with integrated structural elements, and allows for the creation of complex electronic devices and 3D structures with color changes during fabrication, improving efficiency and integration.
Implementation Method 1
a print head apparatus (101) that acts as a means for constructing the multi-layered electronic circuit and components
Implementation Method 2
an optical positioning sensor to enable precision construction of the electronic circuit and components
Implementation Method 3
means to vibrate, heat and/or cool the substrate of the electronic circuit
Implementation Method 4
means to vibrate, heat and/or cool the substrate of the electronic circuit
Implementation Method 5
means to vibrate, heat and/or cool the substrate of the electronic circuit
Implementation Method 6
means to vibrate, heat and/or cool the substrate of the electronic circuit
Implementation Method 7
means to vibrate, heat and/or cool the substrate of the electronic circuit
Implementation Method 8
means for activating a gas removal and air filtration system within the standalone fabrication unit
Data Source
AI summary
A circuit board and component fabrication apparatus comprises a print head configured to deposit one or more materials on a substrate so as to print electronic circuit boards and/or components.