Thin/Thick Film Capacitor TRIZ Cases
- Vertical Trench-Stacked Decoupling Capacitor for High Capacitance Density
A vertically aligned trench and stacked capacitor pair boosts decoupling capacitance in limited substrate volume through parallel connection.
- Glass-Core Thin Film Capacitor Architecture for High-Voltage Packaging
Embedding thin film capacitors in glass-core cavities boosts capacitance density near the die while supporting high-frequency, high-voltage operation.
- Polypropylene Capacitor Film Structure for High-Temperature Withstand Voltage
Controlled shrink behavior and surface skewness help polypropylene capacitor film resist wrinkling and maintain breakdown strength above 110°C.
- Package Substrate Core Capacitor Layout for Larger Capacitance
Embedding capacitors between package sub-core layers increases capacitance without consuming routing area or requiring costly dielectric materials.
- Oxynitride Dielectric Thin Film for Low-Frequency Capacitor Loss
An A-B-O-N oxynitride thin film raises permittivity while cutting low-frequency dielectric loss without additive-heavy dielectric compositions.
- Capacitor Electrode Interconnect Structure Using a Single Conductive Layer
A single conductive layer connects multiple capacitor electrode layers through dielectric openings, cutting interconnect complexity and cost.