Capacitor Electrode Interconnect Structure Using a Single Conductive Layer
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Solution Overview
Problem
Current capacitor structures have high process complexity and manufacturing costs due to complex interconnection structures for electrically connecting electrode layers.
Innovation Solution
A capacitor structure with alternately disposed first and second electrode layers, where a single conductive layer extends into openings in a dielectric layer to electrically connect the electrode layers, reducing complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex interconnection structures are used to electrically connect electrode layers, then electrical connection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges multiple separate interconnection structures into a single integrated conductive layer that simultaneously connects multiple electrode layers. This single conductive layer replaces what would traditionally require multiple separate interconnection structures, thereby reducing device complexity while maintaining electrical connection reliability through the unified design.
Solution Approach 2:
The single conductive layer performs multiple functions by simultaneously serving as an interconnection structure for multiple different electrode layers. This multi-functional design allows one conductive layer to replace what would traditionally require multiple specialized interconnection structures, reducing overall device complexity while ensuring reliable electrical connections.
2Reliability
If complex interconnection structures are used to electrically connect electrode layers, then electrical connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
By combining multiple interconnection functions into a single conductive layer, the patent reduces the number of manufacturing steps and materials required. This merging approach lowers manufacturing cost while maintaining connection reliability through the integrated design that ensures proper electrical connections.
Solution Approach 2:
The universal conductive layer that serves multiple connection purposes reduces manufacturing complexity and material requirements. This multi-functional element can be manufactured in a single process step rather than requiring multiple separate interconnection structures, thereby reducing manufacturing cost while ensuring reliable electrical connections.
3Reliability
If multiple conductive layers are used to connect electrode layers, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines the functions of multiple conductive layers into a single conductive layer that extends through openings in the dielectric layer to connect multiple electrode layers. This merging eliminates the need for multiple separate conductive layers and their associated interfaces, reducing device complexity while maintaining reliable electrical connections through the continuous conductive path.
Data Source
AI summary
A capacitor structure including a substrate, a capacitor, a second dielectric layer, a first conductive layer, and a second conductive layer is provided. The capacitor includes first electrode layers, at least one second electrode layer, and a first dielectric layer. The first electrode layers and the at least one second electrode layer are alternately disposed on the substrate. The first dielectric layer is disposed between the first electrode layer and the second electrode layer. The second dielectric layer has first openings and at least one second opening. The first openings expose the first electrode layers. The second opening exposes the second electrode layer. The first conductive layer is electrically connected to the first electrode layers. The first conductive layer is a single conductive layer disposed on the second dielectric layer and extending into the first openings. The second conductive layer is electrically connected to the second electrode layer.