3D Circuit Structure With Embedded Components And Internal Wiring
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Solution Overview
Problem
Existing three-dimensional circuit structures face issues with wiring line breakage and the need for wiring lines to span over or along end portions, which limits their reliability and design flexibility.
Innovation Solution
A three-dimensional circuit structure is designed with a non-parallel first and second surface connected via a three-dimensional base, where electronic components are embedded in the end portions of these surfaces, and wiring lines are formed only within each surface, eliminating the need for lines to span over or along the end portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring lines are formed to connect electronic components on different surfaces of a three-dimensional base, then electrical connectivity between surfaces is achieved, but the wiring lines must span over or along end portions which increases the risk of breakage
Solution Approach 1:
The patent transitions from two-dimensional planar wiring to three-dimensional spatial wiring by forming wiring lines that extend through the thickness of the three-dimensional base. This allows wiring lines to connect electronic components on different surfaces (first surface and second surface) by passing through the interior volume of the base, eliminating the need for wiring lines to span along end portions where breakage is likely to occur.
2Volume of moving object
If electronic components are embedded in end portions of the three-dimensional base, then compact three-dimensional arrangement is achieved, but wiring lines must extend to end portions increasing breakage risk
Solution Approach 1:
The patent embeds electronic components in end portions of the three-dimensional base to achieve compact arrangement, and simultaneously forms wiring lines that extend through the interior of the base to connect these components. This three-dimensional wiring approach allows wiring lines to reach embedded components without extending along vulnerable end portions, thus maintaining both compactness and reliability.
3Productivity
If multiple printed wiring boards are stacked to form three-dimensional insulation base, then high-density mounting is achieved, but the three-dimensional shape is limited and requires complex multi-layer stacking
Solution Approach 1:
The patent uses a three-dimensional base made of insulating material with embedded electronic components and integrated wiring lines. This composite structure combines the insulating base material with conductive wiring lines and embedded components in a single three-dimensional architecture, eliminating the need for multiple stacked printed wiring boards while achieving high-density mounting.
4Shape
If injection-molded parts are used to form three-dimensional circuit board, then complex three-dimensional shapes are achievable, but wiring lines at end portions are prone to breakage
Solution Approach 1:
The patent forms wiring lines that extend through the interior volume of the injection-molded three-dimensional base, connecting electronic components on different surfaces. This approach allows the wiring lines to avoid extending along end portions where breakage is likely, while still achieving complex three-dimensional shapes through injection molding.
Data Source
AI summary
An electronic component (11) is embedded in an end portion of a surface (P1) and an end portion of a surface (P2) adjacent to each other in a three-dimensional base (2). The portion of an electrode (21) exposed from the surface (P1) and an electrode (101) of a packaged IC (41) are connected to each other via a wiring line (201). The portion of the electrode (21) exposed from the surface (P2) and an electrode (25) of an electronic component (15) are connected to each other via a wiring line (202). Accordingly, it is possible to realize a three-dimensional circuit structure requiring no wiring line spanning over or along an end portion thereof.