3D Rigid Printed Circuits TRIZ Cases
- Endoscope Image Pickup Unit Recess Geometry for Resin Sealing Control
A stepped recess wall and monitored resin injection protect the stacked image sensor in a small-diameter endoscope without resin overflow.
- 3D Glass Module Structure for Low-Loss RF and Thermal Transfer
Copper-filled vias and layered glass enable low-loss RF communication above 100 GHz while improving heat transfer and manufacturability.
- 3D Electronic Module Layout for Stable High-Frequency Impedance
Spacer-controlled dielectric spacing keeps wire-to-GND distance uniform in a 3D module, improving impedance control for high-speed signals.
- PCB Structure With Integral Pillars for Connector-Free Board Stacking
Integrally formed PCB pillars replace connectors in stacked boards, improving alignment, signal stability, and compact assembly.
- 3D Laminate Shaping Jig with Integrated Multi-Calibration Marks
A single plate-shaped jig combines timing, position, and nozzle-state marks to cut calibration area and complexity while maintaining accuracy.