3D Glass Module Structure for Low-Loss RF and Thermal Transfer
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Solution Overview
Problem
Existing multilayer circuit boards face challenges with use specificity, board complexity, feature size limitations, and higher-level integration issues, particularly in applications requiring high-frequency communication and system-on-a-chip integration.
Innovation Solution
A scalable and cost-efficient three-dimensional glass module comprising multiple glass substrates with integrated electronic components and copper-filled holes for thermal management, enabling high-frequency communication and efficient power distribution across layers without alignment requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If glass layers are used for module construction, then manufacturing precision and production yield improve, but brittleness and difficulty in metal bonding worsen
Solution Approach 1:
The patent employs a composite structure combining glass substrates with metal interconnect layers and dielectric materials. The glass provides manufacturing precision and hermetic sealing, while the metal and dielectric components compensate for brittleness and enable reliable electrical connections, resolving the contradiction between glass advantages and its inherent weaknesses.
Solution Approach 2:
The patent introduces metal interconnect layers and dielectric materials as intermediary elements between glass substrates. These intermediaries facilitate metal bonding to glass surfaces and provide mechanical reinforcement, thereby maintaining the manufacturing precision benefits of glass while mitigating its brittleness and bonding difficulties.
2Manufacturing precision
If aligned holes are used for electrical connections between layers, then manufacturing complexity increases, but alignment accuracy improves
Solution Approach 1:
The patent segments the electrical connection function into multiple independent components: through-holes in glass substrates, metal interconnect layers, and dielectric materials. This segmentation allows each component to be manufactured and assembled separately with standard tolerances, reducing the need for high-precision alignment while maintaining connection reliability.
Solution Approach 2:
The patent uses metal interconnect layers and dielectric materials as intermediaries that bridge misaligned holes between glass layers. These intermediaries accommodate alignment tolerances by providing flexible connection paths, thereby reducing manufacturing complexity while maintaining acceptable alignment accuracy.
3Temperature
If copper is filled in holes for thermal transference, then heat dissipation improves, but manufacturing difficulty increases
Solution Approach 1:
The patent performs preliminary actions by forming through-holes and applying metal seed layers on glass substrates before final assembly. This preliminary preparation enables subsequent copper filling and thermal compression bonding to proceed more easily, improving thermal transference while managing manufacturing difficulty through staged processing.
Solution Approach 2:
The patent utilizes thermal compression bonding parameters (temperature, pressure, time) to facilitate copper filling and metal bonding to glass surfaces. By optimizing these parameters, the patent achieves improved thermal transference through copper-filled holes while keeping the manufacturing process feasible and controlled.
4Loss of energy
If glass substrates are used for high frequency communication, then signal loss reduces, but thermal management becomes difficult
Solution Approach 1:
The patent creates a composite structure where glass substrates provide low signal loss for high-frequency communication, while copper-filled holes and metal interconnect layers provide thermal conduction paths. This composite approach maintains the electromagnetic performance of glass while adding thermal management capabilities through conductive materials.
Solution Approach 2:
The patent introduces copper-filled holes and metal interconnect layers as intermediary thermal conduction paths within the glass substrate structure. These intermediaries conduct heat away from electronic components while maintaining the glass's low signal loss properties, thereby resolving the contradiction between communication performance and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass module achieves efficient, accurate, and producible high-frequency communication with low loss and improved thermal transference, overcoming brittleness and alignment issues of traditional glass-based modules.
Implementation Method 1
Another one of the unique and inventive technical features of the present invention is the implementation of a plurality of glass layers, each layer comprising one or more holes filled with copper for bonding the glass layers to each other. Without wishing to limit the invention to any theory or mechanism, it is believed that the technical feature of the present invention advantageously provides for greater thermal transference throughout the plurality of glass layers
Implementation Method 2
Without wishing to limit the invention to any theory or mechanism, it is believed that the technical feature of the present invention advantageously provides for high frequency communications over 100 GHz with low loss
Data Source
AI summary
A hermetic glass module for wireless communication. The module may comprise a plurality of glass layers comprising a first layer having capacitors, inductors, and resonators, a second layer comprising capacitors, inductors, diplexers, and waveguides, a third layer comprising microchips, and capacitors, and a fourth layer comprising a glass cover layer, and antennas disposed within the glass cover layer. The plurality of glass layers may each be separated by a substrate of a plurality of substrates and are connected by a redistribution layer (RDL) of a plurality of RDLs.