PCB Structure With Integral Pillars for Connector-Free Board Stacking

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for accommodating printed circuit boards in electronic devices face limitations such as connector length requirements for increased signal carrying, limited mating heights, complex manufacturing processes, and alignment issues in sandwich stacked PCB designs.

Innovation Solution

A printed circuit board structure with a first portion and a second portion featuring integrally formed pillars extending vertically, allowing for a single-body connection to a main logic board, reducing connector dependency and improving signal integrity and alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If connectors are used to connect interposer board to main logic board, then electrical connection is established, but connector length increases and mating height is limited

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidconnector length
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent extracts and eliminates the connector component from the system by implementing direct PCB-to-PCB coupling through integrally formed pillars. The interposer board is directly connected to the main logic board without intermediate connectors, removing the mating height limitation and reducing overall assembly length while maintaining electrical connection reliability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the interposer board and main logic board into a single integrated structure where pillars are integrally formed with both boards. This consolidation eliminates the need for separate connectors and screws, reducing the overall length and simplifying the assembly while ensuring reliable electrical connections through the integrated pillar structure.

Inventive Principle:
Principle #5Merging (Combining)

2Volume of moving object

If sandwich stacked PCB design is used, then space utilization is improved, but manufacturing complexity increases and alignment precision is required

Engineering Contradiction:
Improvespace utilizationVSAvoidmanufacturing process complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent merges multiple PCB layers into a single integrally formed structure where pillars are created as part of the PCB manufacturing process itself. This integration eliminates the need for separate alignment and assembly steps required in traditional sandwich stacked designs, reducing manufacturing complexity while maintaining compact space utilization.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent performs preliminary action by pre-forming the pillar structures as integral parts of the PCB during the PCB manufacturing process. This preliminary formation of alignment features eliminates the need for precise field alignment during assembly, simplifying the manufacturing process while achieving compact stacking.

Inventive Principle:
Principle #10Preliminary action

3Strength

If connectors with screws are used to fix interposer board, then mechanical stability is achieved, but device complexity and assembly steps increase

Engineering Contradiction:
Improvemechanical stabilityVSAvoidassembly components
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent merges the mechanical support function and electrical connection function into a single integrated pillar structure. The pillars are integrally formed with both the interposer board and main logic board, providing both mechanical stability and electrical connection without requiring separate screws or fasteners, thereby reducing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements multi-functionality where the integrally formed pillars serve dual purposes: providing mechanical support/stability and establishing electrical connections. This eliminates the need for separate mechanical fasteners and electrical connectors, reducing assembly components and simplifying the overall design.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250344318A1Printed Circuit Board Including a First Portion and a Second Portion with a Pillar Extending from the First Portion
Publication Date: 2025.11.06 GOOGLE LLC
  • US20250344318A1 patent drawing
  • US20250344318A1 patent drawing
  • US20250344318A1 patent drawing

AI summary

A printed circuit board (100) for an electronic device includes a first portion (110) including an upper board (112) having a first width (w1) in a widthwise direction of the upper board (112). and a second portion (120), integrally formed with the first portion (110) as a single body. the second portion (120) including one or more pillars (122) extending vertically from the first portion (110) and disposed between a first end (114) of the upper board (112) and a second end (116) of the upper board (112) in the widthwise direction. Each of the one or more pillars (122) has a second width (w2) in the widthwise direction which is narrower than the first width (w1).