3D Circuit Structure Waterproof Encapsulation
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Solution Overview
Problem
Conventional 3D circuit structures are vulnerable to moisture, dust, scratches, and peeling, leading to unstable electrical characteristics and non-compliance with safety codes for electrical insulation due to exposed metal conducting traces without adequate protection.
Innovation Solution
A 3D circuit structure featuring a 3D insulating substrate with a circuit trace layout layer and an insulating encapsulation member that covers the circuit forming zone, providing waterproof, dustproof, scratch-resistant, and secure characteristics while ensuring compliance with safety codes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal conducting traces are exposed on the carrier surface for 3D circuit formation, then circuit functionality is achieved, but the circuit becomes vulnerable to moisture, dust, scratches, and peeling
Solution Approach 1:
The patent applies a thin film encapsulation layer that conformally covers the 3D circuit structure, including vertical walls and horizontal surfaces. This flexible thin film provides comprehensive protection against moisture, dust, and scratches while maintaining the 3D circuit's electrical functionality and geometric complexity.
Solution Approach 2:
The patent employs composite material structures combining the carrier substrate, metal conducting traces, and protective encapsulation layers. This multi-material composite approach enables simultaneous achievement of electrical conductivity, mechanical protection, and environmental resistance in the 3D circuit structure.
2Reliability
If metal conducting traces are formed on the carrier surface, then circuit connectivity is established, but adhesion is poor and traces tend to peel off
Solution Approach 1:
The patent implements localized adhesion enhancement through specific surface treatments or adhesion promoter layers applied only at the interface between metal traces and carrier. This local quality modification improves trace-to-carrier bonding strength precisely where needed without affecting other circuit properties.
3Reliability
If metal conducting traces are exposed to open space, then circuit functionality is maintained, but safety code compliance for electrical insulation is failed
Solution Approach 1:
The patent uses thin film encapsulation to provide electrical insulation for exposed metal traces in 3D circuit configurations. This approach ensures safety code compliance while maintaining the compact 3D structure without requiring complex external insulation housings or enclosures.
Data Source
AI summary
A three-dimensional (3D) circuit structure includes a 3D insulating substrate having at least one circuit forming zone and at least one exposed contact forming zone; at least one circuit pattern portion provided on the 3D insulating substrate and having at least one circuit trace layout layer located in the circuit forming zone and at least one exposed contact located in the exposed contact forming zone and connected to the circuit trace layout layer; and an insulating encapsulation member covering at least the circuit forming zone and the circuit trace layout layer. With the insulating encapsulation member, the circuit trace layout layer is waterproof, dustproof, scratch-resistant, peeling-proof, secure for use, and compliant with safety codes of electrical insulation, enabling the 3D circuit structure in use to have stable electrical characteristics.