3D Circuitized Structure with Partially Cured Thermosetting Substrate
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Solution Overview
Problem
Conventional circuitized structures, such as PCBs and IMSs, are rigid and unsuitable for 3D configurations, prone to damage and delamination when bent, while flexible circuits lack mechanical support and protection for electronic devices.
Innovation Solution
A method involving a partially cured thermosetting material is used to create a 3D circuitized structure by stopping the cure at the B-stage before reaching the gel point, allowing for forming into a 3D configuration without damage and maintaining integrity, enabling standard manufacturing processes for cost-effective mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid circuitized structure (PCB or IMS) is used, then mechanical strength and structural stability are improved, but the ability to form 3D configurations and adapt to non-flat shapes deteriorates
Solution Approach 1:
The patent changes the physical-chemical parameters of the insulating substrate by controlling the cure stage of the thermosetting material. By stopping the cure at the B-stage (before gel point), the substrate maintains partial flexibility while retaining enough structural integrity to support electronic devices. This parameter change enables the substrate to be formed into 3D configurations without damage, resolving the contradiction between rigidity and adaptability.
Solution Approach 2:
The patent introduces dynamic characteristics to the insulating substrate through partial curing. The B-stage substrate exhibits viscoelastic behavior, allowing it to dynamically adapt to 3D shapes during forming operations. Once the cure is completed after forming, the structure gains final structural stability. This dynamic property enables the substrate to transition from a flexible state during manufacturing to a rigid state in service.
2Adaptability or versatility
If a flexible circuitized structure (FPC) is used, then the ability to bend and conform to shapes is improved, but mechanical strength and protection for electronic devices deteriorates
Solution Approach 1:
The patent uses parameter changes by controlling the cure stage to achieve optimal balance between flexibility and strength. The B-stage substrate provides sufficient flexibility for bending while maintaining enough structural integrity to support electronic devices. This resolves the contradiction by adjusting the physical-chemical state of the substrate material.
3Strength
If a stiffener is attached to an FPC to increase rigidity, then mechanical strength is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the stiffening function directly into the insulating substrate material itself, rather than adding separate stiffener components. By using a thermosetting material with controlled cure characteristics, the substrate inherently provides both flexibility and structural strength, eliminating the need for additional stiffener layers and simplifying the manufacturing process.
Solution Approach 2:
The patent employs composite material principles by combining the insulating substrate with the thermosetting material in a single integrated structure. The composite structure provides both the required flexibility and mechanical strength without requiring separate stiffener components, thereby reducing manufacturing complexity.
4Stability of the object's composition
If the insulating substrate is fully cured before forming into 3D configuration, then structural stability is improved, but the risk of cracks, wrinkles, and delamination during bending increases
Solution Approach 1:
The patent applies preliminary action by forming the substrate into its final 3D configuration before completing the cure process. The substrate is formed at the B-stage when it has sufficient flexibility to accommodate 3D shapes without cracking, and only after forming is the cure completed to lock in the desired configuration. This preliminary forming action prevents cracks and delamination that would occur if forming were attempted on a fully cured substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a rigid yet flexible 3D circuitized structure with improved dimensional stability, thermal resistance, and electrical properties, preventing cracks, wrinkles, and delamination, making it suitable for high-volume applications.
Implementation Method 1
The insulating material includes a thermosetting material being partially cured by stopping a cure thereof at a B-stage before reaching the gel point
Implementation Method 2
completing the cure of the thermosetting material
Data Source
AI summary
A circuitized structure with a 3-dimensional configuration. A base structure is provided that includes an insulating substrate of electrically insulating material with a flat configuration, and further includes an electric circuit including at least one layer of electrically conductive material arranged on the insulating substrate. The insulating material includes a thermosetting material being partially cured by stopping a cure thereof at a B-stage before reaching a gel point. The base structure is formed according to the 3-dimensional configuration, and the cure of the thermosetting material is completed.