3D Rigid Printed Circuits TRIZ Cases

A 3D printed sensor uses an auxetic dielectric lattice between conductive substrates to change capacitance under mechanical load.

Recessed regions adjacent to electrodes absorb thermal stress from resin expansion mismatches, preventing junction failures in rotation detectors.

An image processing device scans wiring patterns to calculate intersection distances and determine pixel dot formation.

Vertical relay substrate eliminates horizontal lead terminals to shrink mounting area while maintaining reliable electrical connections.

Additive manufacturing deposits conductive ink to form continuous traces across multiple substrate surfaces, resolving microscale alignment challenges.

A display apparatus uses a heat sink plane with a coupling groove and guide holder to attach circuit boards securely.

Transparent circuit boards integrate conductive traces and components within ophthalmic lenses to deliver illumination directly to the eye.

A conductive mesh embedded in electronic device encapsulants detects physical intrusion through electrical resistance changes.

A line embedding head uses a curved channel to output wire at an angle relative to the substrate.

An injection-molded MID carrier integrates conductor tracks on its rear side to mount wired LEDs in precise three-dimensional positions.

A wiring substrate pad features a curved connecting surface within a taper-shaped through hole to disperse mechanical stress.

A flexible circuit bridges electrical connections between embedded layers in composite laminates.

A 3D stacked package structure uses a molding frame and conductive unit to enable vertical stacking of electronic components.

A heat-radiating printed circuit board merges with a blanket to form an integrated structure that conducts thermal energy directly to the chassis.

A ground layer structure deposited via additive manufacturing reduces electrical noise and magnetic field interference around integrated circuits.

Inclined conductor pattern edges eliminate ridge angles that cause short circuit failures in multilayer wiring boards.

Outermost insulating layers wrap electrolytic metal posts to eliminate interfaces, reducing short circuit risk while maintaining connection reliability.

Extruded nanofiber mats impregnated with resin create uniform dielectric substrates for high-frequency circuit applications.

Slits formed via FEM stress analysis reduce concentration on film-like members, preventing wrinkles and preserving antenna characteristics on curved surfaces.

Hybrid bonding joins build-up and ceramic substrates via dielectric-to-dielectric interfaces, eliminating bridging failure in high I/O probe cards.

Heated thermoplastic embedding prevents optical defects and shear stress during multilayer laminate manufacturing.

A pliable component-carrying member supports electronic components within an injection moulded layer for adaptable vehicle integration.

A vehicle electronic device housing integrates a conductor unit and contact means to consolidate multiple electrical loads into one compact module.

Additive layer-free production creates spatial structures guiding electromagnetic waves without vias.

Replacing laser drilling with photoimageable dielectric layers simplifies manufacturing while maintaining reliable interlayer adhesion.

Forming a trench in the PCB substrate suppresses heat transmission between packages, reducing production costs and maintaining compact device size.

Asymmetric wiring structure balances thermal expansion mismatches between dielectric and circuit layers to reduce substrate warpage during processing.

A circuit board uses a patterned adhesive layer to bond dielectric materials and enable dry etching for fine conductive lines.

A printed circuit board uses differentiated metal foil surface roughness to balance signal conductivity with adhesive strength.

Reinforcement members attach to a flexible member and fuse through holes in a mounting member, preventing separation on complex surfaces.

An embedded circuit board uses tapered trace projections and early AOI inspection to boost yield rates and structural strength.

Laser ablation removes core material to create controlled gaps, preventing magnetic saturation from DC currents while maintaining AC inductance.

A polymer chassis with electroplated metallic layers integrates antennas and shielding directly into the structural component.

A conformal mask defines patterns on three-dimensional substrates, enabling electroplating to build thick solderable circuits with low resistance.

Embedding leadframes within molded package bodies exposes leads through sidewalls for direct surface mount device mounting.

A 3D circuitized structure uses a partially cured thermosetting insulating substrate to form complex shapes, preventing cracks and delamination during bending.

A vertically separated electrode structure uses a polymeric post with an inorganic cap to define short channel vertical thin film transistors.

Stacked dam portions and conductive through vias create a wiring structure that reduces substrate warpage while maintaining manufacturing yield.

A spiral-shaped substrate enables uniform three-dimensional light emission while resolving the trade-off between omnidirectional glow and thermal management.

A corrugated microwave interconnection substrate provides flexibility to bridge height differences between components.

A coreless interposer substrate uses recessed grooves filled with dielectric material to form conductive blocks and wiring layers directly on a carrier.

Stacked conductive antenna layers reduce the printed circuit volume while maintaining electromagnetic induction efficiency for medical implants.

A wiring substrate uses a third metal layer to cover side surfaces and fill gaps between adjacent patterns.

Three-dimensional substrates enable complex circuit shapes by arranging components in non-planar configurations, overcoming the design limits of flat boards.

A hybrid printed circuit assembly integrates high density regions using electroless copper deposition and electroplating to form conductive structures.

Laser carbonizes polymer coatings in open air by tuning power and speed to prevent combustion.

A continuous ring-shaped dam structure controls molding material flow on semiconductor packaging apparatuses.

A semiconductor substrate uses an asymmetric reinforcement structure to adjust dielectric layer curvature and counterbalance warpage.