3D Printed Sensor With Auxetic Dielectric Lattice
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Solution Overview
Problem
Current 3D printing technologies face challenges in creating sensors that effectively integrate conductive and dielectric materials to accurately measure forces and strains, particularly in applications requiring high sensitivity and durability, such as in protective gear and medical orthotics.
Innovation Solution
A 3D printed structure comprising a latticed dielectric structure with auxetic properties, sandwiched between conductive substrates, which absorbs forces through compression and changes capacitance, allowing for precise measurement of force locations and intensities by varying the bend angle and Poisson ratio of unit cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional 3D printing methods are used to create sensors, then manufacturing simplicity is maintained, but measurement precision and sensitivity are insufficient
Solution Approach 1:
The sensor is segmented into distinct functional layers: conductive substrate layers and a dielectric lattice layer. This segmentation allows each layer to be optimized independently for its specific function while being manufactured as an integrated structure through 3D printing, thereby improving measurement precision without proportionally increasing overall device complexity
Solution Approach 2:
The sensor employs composite material construction with conductive substrates and dielectric lattice structures. This composite approach enables the integration of materials with complementary properties (conductive for electrode function, dielectric for insulation and mechanical response) to achieve enhanced measurement precision while maintaining manufacturing feasibility
2Measurement precision
If the dielectric structure uses standard lattice configurations, then manufacturing ease is maintained, but sensitivity to force and strain is insufficient
Solution Approach 1:
The dielectric lattice structure employs local quality variations through different unit cell configurations (e.g., tetrahedral, octahedral, gyroscopic) distributed throughout the structure. This allows regions of the lattice to have different mechanical properties optimized for local stress/strain conditions, enhancing overall sensitivity while remaining manufacturable through systematic 3D printing processes
3Reliability
If conductive and dielectric materials are separately integrated, then material functionality is optimized, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process merges the fabrication of conductive substrates and dielectric lattice into a single integrated 3D printing operation. This combining of previously separate manufacturing steps into one unified process achieves reliable multi-material integration without proportionally increasing manufacturing complexity, as the additive manufacturing system inherently handles multi-material deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the sensitivity and durability of force measurement, enabling detailed analysis of impact locations and forces, and can be integrated into various applications like protective gear and medical devices.
Implementation Method 1
the dielectric structure including a latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction
Implementation Method 2
which absorbs forces through compression and changes capacitance, allowing for precise measurement of force locations and intensities
Data Source
AI summary
Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example method of building a sensor with a 3D printer includes building a first conductive substrate and building a second conductive substrate. The example method also includes building a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a first latticed structure including a first plurality of legs extending inwardly at a first angle and a second latticed structure including a second plurality of legs extending inwardly at a second angle.