Continuous Dam Structure for Semiconductor Packaging

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Solution Overview

Problem

Current semiconductor packaging techniques face challenges in miniaturization and efficient application of molding materials, leading to potential delamination and defects in stacked semiconductor devices, particularly in package-on-package (PoP) configurations.

Innovation Solution

The implementation of a continuous ring-shaped dam structure around contact pads on packaging apparatuses to control the application of molding or underfill materials, preventing their flow into interior regions and ensuring precise material distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If molding material is applied without a dam structure, then the packaging process is simpler, but material pitting and delamination occur

Engineering Contradiction:

Improvepackaging reliabilityVSAvoidpackaging process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The dam structure is formed in advance on the packaging apparatus before applying the molding material. This preliminary action creates a physical barrier that prevents material from flowing into regions where it would cause pitting or delamination, thereby improving reliability without adding complex process steps during material application.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The dam structure acts as an intermediary element between the molding material and the sensitive regions of the packaging apparatus. It mediates the material flow, allowing the molding process to remain simple while preventing harmful material accumulation that would compromise packaging reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If a continuous ring dam structure is used to control molding material flow, then material distribution precision is improved, but device complexity increases

Engineering Contradiction:

Improvematerial distribution precisionVSAvoidpackaging apparatus complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The dam structure is segmented into discrete regions corresponding to different contact pad areas. This segmentation allows precise control of molding material flow into specific interior regions while maintaining a relatively simple overall structure that can be integrated into existing packaging apparatus.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dam structure can be implemented as a thin film or layered structure that is deposited or formed on the packaging apparatus. This approach achieves precise material distribution control without adding significant structural complexity or bulk to the packaging system.

Inventive Principle:

Principle #30Flexible shells and thin films

3Manufacturing precision

If additional photo-masks or lithography processes are used to prevent material defects, then manufacturing precision is improved, but productivity decreases

Engineering Contradiction:

Improvedefect prevention precisionVSAvoidpackaging process productivity

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces complex photo-masking and lithography processes with a mechanical dam structure approach. The dam structure physically guides and contains the molding material flow, achieving the same defect prevention function without requiring additional photolithography steps, thereby maintaining high productivity while ensuring manufacturing precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11094622B2Packaged semiconductor devices and methods of packaging thereof

Publication Date: 2021.08.17 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Packaging methods for semiconductor devices and methods of packaging thereof are disclosed. In some embodiments, a device includes a packaging apparatus and contact pads disposed on the packaging apparatus. The contact pads are arranged in an array of rows and columns. The contact pads include first contact pads proximate a perimeter region of the packaging apparatus and second contact pads disposed in an interior region of the packaging apparatus. A dam structure that is continuous is disposed around the second contact pads. The contact pads comprise a mounting region for a semiconductor device.