Orthogonal Relay Design Reduces PCB Mounting Area
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Solution Overview
Problem
The existing solid state relays occupy a larger mounting area on circuit boards due to lead terminals extending in opposite directions, making it difficult to downsize the printed board.
Innovation Solution
A relay design featuring a base with a board connector and a relay substrate extending orthogonally from the base, united with a case filled with sealant, which reduces the mounting area by eliminating the need for lead terminals and includes features like assembly guides, recesses for soldering, and drainage gaps to enhance assembly accuracy and prevent sealant leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If lead terminals extend in opposite directions from both end portions of the relay main body, then the relay can be connected to the printed board, but the mounting area occupied by the relay becomes larger
Solution Approach 1:
The patent changes the arrangement dimension of lead terminals from a linear extension along the printed board to a vertical arrangement perpendicular to the printed board surface. The relay main body is positioned upright with lead terminals extending downward to contact the printed board, transforming the mounting footprint from a large horizontal area to a compact base area, thereby resolving the contradiction between connection ease and mounting area reduction.
Solution Approach 2:
The patent employs asymmetric design where the relay main body has a specific base shape with uneven lead terminal distribution. The base portion is designed with asymmetric geometry to accommodate the vertical lead terminal arrangement, allowing optimal space utilization on the printed board while maintaining reliable electrical connection, thus reducing the effective mounting area compared to symmetric horizontal arrangements.
2Device complexity
If the relay main body extends parallel to the printed board, then the structure is simple, but the mounting area is larger and downsize is difficult
Solution Approach 1:
The patent transitions the relay main body from a horizontal extension parallel to the printed board to a vertical extension perpendicular to the printed board. This dimensional change allows the relay to achieve compact mounting footprint while maintaining structural simplicity through the upright configuration, effectively resolving the contradiction between structural simplicity and mounting area reduction.
3Reliability
If lead terminals extend from both end portions in opposite directions, then electrical connection is achieved, but the occupied space increases
Solution Approach 1:
The patent repositions the lead terminal extension from a horizontal plane to a vertical dimension. Lead terminals extend downward from the base in the vertical direction rather than horizontally from end portions, concentrating the connection point area on the printed board and significantly reducing the space occupied by the relay assembly while ensuring reliable electrical connection.
Solution Approach 2:
The patent merges the lead terminal functions into a unified vertical arrangement at the base, combining multiple electrical connection points into a compact footprint area. This consolidation approach maintains all necessary electrical connections while minimizing the overall space occupied by the relay on the printed board, resolving the contradiction between connection reliability and space occupation.
Data Source
AI summary
A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).