Printed Wiring Board Metal Post Insulation and Plating
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Solution Overview
Problem
Existing printed wiring boards with conductor posts face issues of short circuits and reliability due to close spacing and interfaces between metal posts and conductor layers, which can lead to increased resistance and stress from thermal expansion differences.
Innovation Solution
A printed wiring board design featuring a resin insulating layer, a conductor layer, an outermost insulating layer with openings for metal posts, and a manufacturing method that forms metal posts using electrolytic plating films without interfaces, ensuring reliable connection and reduced resistance by embedding the electrolytic plating films within the outermost insulating layer and controlling thickness for minimal protrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If metal posts are placed close together to increase component density, then productivity and miniaturization are improved, but the risk of short circuits increases due to insufficient insulation
Solution Approach 1:
The invention transitions from planar insulation to three-dimensional insulation by having the outermost insulating layer wrap around the metal posts. This vertical/dimensional approach to insulation allows closer horizontal spacing of posts while maintaining adequate insulation distances, thereby increasing component density without proportionally increasing short circuit risk.
Solution Approach 2:
The invention uses a composite structure combining the metal post, the outermost insulating layer, and the resin insulating layer. This multi-material composite approach provides enhanced insulation performance that allows closer spacing of metal posts while maintaining reliability, as the combined insulating effect of multiple layers and materials offers better protection than single-layer insulation.
2Reliability
If interfaces between metal posts and conductor layers are eliminated to reduce resistance, then connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The invention merges the metal post formation process with the conductor layer formation process by using electrolytic plating to grow the metal post directly from the conductor layer material. This eliminates the need for separate interface layers and reduces manufacturing steps, as the conductor layer material itself forms the metal post through controlled plating, thereby improving connection reliability while actually simplifying the overall manufacturing process.
Solution Approach 2:
The conductor layer material serves itself by being transformed into the metal post through electrolytic plating. The same material that forms the conductor layer becomes the metal post material, eliminating the need for additional interface materials or complex joining processes. This self-service approach reduces both resistance at interfaces and manufacturing complexity.
3Length of moving object
If metal posts are made thinner to reduce size, then miniaturization is improved, but resistance increases and connection reliability deteriorates
Solution Approach 1:
The invention changes the material parameters and structural parameters of the metal post system. By using high-conductivity metal materials and optimizing the electrolytic plating parameters, thinner posts can achieve the same or better conductivity than thicker posts made with conventional methods. The precise control of plating thickness and material composition allows miniaturization without compromising connection reliability.
4Reliability
If electrolytic plating films are used to form metal posts without interfaces, then resistance is reduced and connection reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The electrolytic plating process inherently includes feedback control mechanisms where the plating conditions (current density, electrolyte composition, temperature) are carefully controlled and monitored to achieve uniform thickness and composition. This feedback control ensures that the metal posts are formed with precise dimensions and consistent properties, meeting the required manufacturing precision while eliminating interfaces and reducing resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances connection reliability, reduces short circuit risk, and maintains consistent resistance by eliminating interfaces and controlling metal post dimensions, thus improving insulation and connection reliability.
Implementation Method 1
forming an electrolytic plating film on the seed layer, forming a metal post including electrolytic plating on the electrolytic plating film
Data Source
AI summary
A printed wiring board includes a resin insulating layer, a conductor layer formed on a surface of the resin insulating layer, an outermost insulating layer formed on the resin insulating layer such that the outermost insulating layer is covering the conductor layer and has an opening extending to the conductor layer, and a metal post formed in the opening of the outermost insulating layer such that the metal post is protruding from the outermost insulating layer.