Layer-Free Additive Manufacturing for RF Signal Integrity
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Solution Overview
Problem
Existing printed circuit board manufacturing methods result in a high number of interference points, particularly in radio frequency applications, due to the need for multiple layers and vias, which complicates signal transmission and heat dissipation, and requires numerous process steps with associated precision issues and material limitations.
Innovation Solution
A method for producing layer-free spatial structures using additive processes that allow for the simultaneous or sequential application and removal of materials to create conductive or non-conductive structures optimized for electromagnetic wave guidance, reducing the need for vias and layer changes, and enabling flexible, three-dimensional designs with improved heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photolithographic process with multiple layers and vias is used, then electrical connections can be established, but interference points increase and signal integrity deteriorates
Solution Approach 1:
The patent transitions from traditional planar 2D layered PCB structures to 3D volumetric structures using additive manufacturing. Conductive pathways are created in three-dimensional space rather than being constrained to sequential layers, eliminating the need for vias and reducing interference points while maintaining electrical connectivity.
Solution Approach 2:
The invention extracts and eliminates the via structure from the electrical connection system. By using additive manufacturing to directly create conductive pathways through volumetric deposition, the patent removes the need for drilled holes and plated vias that traditionally connect layers, thereby reducing interference points and improving signal integrity.
2Quantity of substance
If number of layers is increased to accommodate higher connection density, then production design rules are met, but manufacturing precision requirements increase
Solution Approach 1:
The patent resolves the precision problem by moving from 2D layer alignment to 3D volumetric fabrication. Additive manufacturing deposits conductive material layer-by-layer in three-dimensional space with direct digital control, eliminating the cumulative alignment errors that occur when stacking multiple traditional PCB layers with vias.
Solution Approach 2:
The invention changes the fundamental manufacturing parameter from mechanical layer stacking with alignment tolerances to digital volumetric deposition. The additive process uses computer-controlled material deposition with precise spatial resolution, transforming the precision requirement from mechanical alignment to digital positioning, which offers superior control and repeatability.
3Manufacturing precision
If etching process is used to create traces, then conductive patterns are formed, but material waste increases and small structural widths cannot be achieved
Solution Approach 1:
Instead of starting with a continuous conductive layer and removing material through etching, the patent inverts the approach by directly depositing conductive material only where needed in three-dimensional space. This additive approach eliminates material waste while achieving precise trace widths, as material is placed only in the final desired configuration rather than being cut from a larger substrate.
Solution Approach 2:
The invention applies conductive material with local precision through additive manufacturing, depositing copper or other conductive materials only at the specific locations and geometries required for electrical connections. This eliminates the need for blanket copper deposition followed by etching, reducing material waste while achieving high precision in trace width and pattern definition.
4Ease of manufacture
If multiple machine changes are performed during manufacturing, then different process steps are completed, but position imprecisions accumulate
Solution Approach 1:
The patent merges multiple separate manufacturing processes (deposition, patterning, and connection formation) into a single additive manufacturing operation. The volumetric additive process completes all electrical connection structures in one integrated manufacturing step, eliminating the need for multiple machine changes and the associated cumulative positioning errors from repeated workpiece registration.
Data Source
AI summary
The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.