PCB Trench Thermal Isolation Between Packages
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Solution Overview
Problem
In printed circuit boards, heat transmission between mounted packages can cause performance degradation, and existing methods to mitigate this, such as using heat sinks or increasing board size, are costly and may distort signal waveforms due to altered signal line routing.
Innovation Solution
A trench is formed in the printed circuit board substrate between packages, with an opening portion on one side, allowing for thermal isolation and direct signal line routing without penetrating vertically, thus reducing heat transmission and maintaining compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If heat sinks are used to reduce heat transmission between packages, then heat isolation is improved, but production cost increases
Solution Approach 1:
The patent extracts the heat transmission path by forming a trench that removes the substrate material between packages. This physical removal creates a thermal barrier without requiring additional heat sink components, thereby reducing heat transmission while avoiding the increased production costs associated with heat sinks.
Solution Approach 2:
The invention uses a simple trench structure formed by removing substrate material, which is a cost-effective approach compared to expensive heat sink components. The trench provides sufficient thermal isolation for the application without requiring complex or expensive materials.
2Object-affected harmful factors
If board size is increased to reduce heat transmission between packages, then heat isolation is improved, but device size increases
Solution Approach 1:
The patent segments the substrate by introducing a trench that divides the continuous substrate into separated regions between packages. This segmentation creates thermal isolation zones without requiring increased board dimensions, allowing heat isolation while maintaining compact device size.
Solution Approach 2:
Instead of increasing board size (2D expansion) to achieve heat isolation, the patent introduces a vertical dimension by forming a trench that extends through the substrate thickness. This dimensional approach provides thermal isolation within the existing board footprint, preventing device size increase.
3Object-affected harmful factors
If signal line routing is altered to accommodate heat isolation measures, then heat transmission is reduced, but signal waveform distortion increases
Solution Approach 1:
The trench acts as an intermediary thermal barrier between packages while maintaining signal line continuity. Signal lines can be routed along the trench walls or through the substrate without requiring complex alterations, thus preserving signal waveform quality while achieving heat isolation through the trench structure.
4Object-affected harmful factors
If vertical through-holes are formed to isolate heat between packages, then heat transmission is reduced, but signal line routing complexity increases
Solution Approach 1:
The patent applies local quality by forming a trench with specific opening portions at predetermined locations rather than a complete vertical through-hole. This localized approach provides heat isolation where needed while leaving other areas open for straightforward signal line routing, thereby reducing routing complexity compared to full through-holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The trench effectively suppresses heat transmission between packages, preventing performance degradation while allowing for linear signal line routing, thereby reducing production costs and maintaining a compact electronic device size.
Implementation Method 1
The trench effectively suppresses heat transmission between packages
Data Source
AI summary
According to one embodiment, there is provided a printed circuit board including a substrate having a trench between a first region and a second region. The first region is a region where a first package is to be mounted. The second region is a region where a second package is to be mounted. The trench has an opening portion in at least one of a first main surface and a second main surface of the substrate. The first main surface is a surface on which the first package is placed. The second main surface is positioned on reverse side of the first main surface of the substrate.