Corrugated Microwave Interconnect for Step Height Compensation
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Solution Overview
Problem
Conventional interconnection technologies in microwave equipment, particularly in high-frequency Q and V bands, face challenges such as limited bandwidth, significant electrical paths, and difficulty in accommodating step heights, leading to signal distortion and thermal expansion issues.
Innovation Solution
A microwave interconnection device with a corrugated substrate that provides flexibility and adaptability, featuring contact pads to compensate for height differences and thermal expansion, allowing for broadband connections insensitive to thermal changes and capable of handling diverse step heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If wired interconnection technology is used to connect MMIC chips, then the connection can be established between components, but the bandwidth is greatly limited and signal distortion occurs
Solution Approach 1:
The patent replaces wired mechanical interconnection with a direct planar metallization connection system. The substrate includes first and second metallizations that directly connect contact pads on opposite faces of the substrate, eliminating the need for external wired connections and thereby increasing bandwidth while maintaining signal quality through a controlled electromagnetic path.
Solution Approach 2:
The substrate acts as an intermediary element that provides both mechanical support and electrical connection. The metallizations embedded in the substrate create a controlled impedance path between MMIC chips, serving as a mediator that maintains signal integrity while enabling high-frequency transmission without the limitations of external wiring.
2Reliability
If conventional interconnection methods are used, then components can be connected, but large electrical paths are generated leading to signal distortion at high frequencies
Solution Approach 1:
The patent transitions from external three-dimensional wired connections to an integrated planar metallization system embedded within the substrate. This dimensional reorganization creates a direct, controlled electrical path through the substrate thickness rather than allowing long external wire paths, thereby reducing electrical path length and maintaining signal quality at high frequencies.
3Adaptability or versatility
If planar components are integrated with different heights, then heterogeneous technologies can be combined, but substantial step heights are created that are prohibitive for frequency increase
Solution Approach 1:
The patent applies local quality by creating metallizations with varying thicknesses and positions tailored to specific connection requirements. The substrate can accommodate components of different heights by providing localized metallization structures that bridge height differences, allowing heterogeneous integration while maintaining controlled impedance paths suitable for high-frequency operation.
4Adaptability or versatility
If wired interconnection is used to accommodate step heights between components, then connection flexibility is provided, but the bandwidth is greatly limited
Solution Approach 1:
The patent replaces flexible wired interconnection with a rigid but adaptable metallization system embedded in the substrate. The metallizations are designed to accommodate step heights through their geometric configuration and positioning, providing connection flexibility through structural design rather than through flexible wiring, thereby maintaining high bandwidth capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables flexible and high-bandwidth interconnections that maintain signal quality and adaptability across varying temperatures and step heights, reducing the reliance on wired connections and enhancing compatibility with heterogeneous components.
Implementation Method 1
The invention aims to reduce the importance of wired interconnections in microwave equipment that can be used in high frequency ranges such as the Q and V bands, by proposing a microwave interconnection device allowing broadband interconnection greater than 500 micrometers and being able to make the interconnection insensitive to thermal expansion
Implementation Method 2
the upper face of the substrate is corrugated along the second axis, capable of giving the substrate flexibility along the first axis
Data Source
Figure 1a~1b
Figure 2~4
Figure 5~6
AI summary
The invention relates to a microwave interconnection device (60) between two components (40, 50), each component comprising an upper face (42, 52) and a signal line (41, 51) disposed on the upper face (42, 52), the planes containing the upper faces (42, 52) of the components (40, 50) being separated by a distance called height difference (70). The microwave interconnect device (60) includes a substrate (80) comprising a lower face and an upper face (82) defined by a first axis (X) and a second axis (Y) perpendicular to the first axis (X), a signal line (83) disposed on the lower face of the substrate (80), a projection of the signal line (83) in the plane (XY) of the upper face (82) constituting the first axis (X), at least two contact pads (90, 91) suitable for electrically connecting the signal line (83) of the device (60) to the signal line (41, 51) of the components (40, 50).According to the invention, the upper face (82) of the substrate (80) is corrugated along the second axis (Y), suitable for giving the substrate (80) flexibility along the first axis (X).