Multi-Surface Additive Traces for PCB Microscale Connections

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Solution Overview

Problem

Creating microscale electrical connections on printed circuit boards (PCBs) is challenging due to the difficulty in forming multiple connections across multiple surfaces while maintaining precise angles and alignment.

Innovation Solution

A method involving determining location points on multiple surfaces of a substrate for forming traces, with additional points interpolated to create intermediate traces, using an additive manufacturing apparatus that includes a nozzle and print head to deposit ink and cure it on the substrate, allowing traces to traverse and connect across surfaces at specific angles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional methods are used to create electrical connections on PCBs, then manufacturing processes are simpler, but the ability to create multiple microscale connections across multiple surfaces is limited

Engineering Contradiction:
Improveability to create multiple microscale connectionsVSAvoidmanufacturing process complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent extends trace routing from a single-plane constraint to multi-surface capability by allowing traces to traverse across multiple surfaces of the PCB at various angles. This dimensional expansion enables connections that wrap around edges and connect components on opposite sides of the board, effectively adding spatial dimensions to the routing problem.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The system pre-calculates and determines optimal location points for traces before manufacturing begins. By computing the precise coordinates and angles for trace routing across multiple surfaces in advance, the system prepares a complete manufacturing roadmap that guides the additive process, reducing real-time complexity.

Inventive Principle:
Principle #10Preliminary action

2Adaptability or versatility

If traces are routed across multiple surfaces at various angles, then connection versatility improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improvetrace routing flexibilityVSAvoidlocation point accuracy
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The system performs all geometric calculations and determines precise location points for traces across multiple surfaces before manufacturing begins. By pre-computing the exact coordinates, angles, and intersection points where traces will meet surfaces and edges, the system eliminates the need for complex real-time adjustments during manufacturing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces manual or mechanical measurement and positioning methods with computational geometry and digital modeling. The system uses software to calculate optimal trace paths and location points with high precision, then guides the additive manufacturing apparatus through digital control, substituting physical measurement tools with mathematical precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If additive manufacturing is used to print traces, then manufacturing flexibility improves, but the process requires precise control of deposition and curing

Engineering Contradiction:
Improvetrace formation flexibilityVSAvoiddeposition and curing control
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical trace formation methods with additive manufacturing technology. The system uses a digitally controlled nozzle to deposit conductive material layer by layer, with each deposition location precisely determined by pre-calculated geometry. This substitution of mechanical routing with digital deposition enables complex multi-surface traces while maintaining control through software rather than mechanical complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the formation of continuous, electrically conductive traces across multiple surfaces of a PCB, facilitating efficient electrical connections and potential activation of pads through controlled current application, thereby enhancing the substrate's electrical functionality.

Implementation Method 1

a nozzle of a print head to deposit ink to form the third trace and the additional traces on the substrate

Methodology Applied
Scientific EffectDeposition: Deposition (physical)

Implementation Method 2

deposit ink to form the third trace and the additional traces on the substrate

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS12082347B2Method for printing traces on a substrate and an additive manufacturing apparatus therefor
Publication Date: 2024.09.03 XTPL SA
  • US12082347B2 patent drawing
  • US12082347B2 patent drawing
  • US12082347B2 patent drawing

AI summary

A method for printing traces on a substrate and an additive manufacturing apparatus therefor are provided. The method comprises determining at least two first location points for a first trace and at least two second location points for a second trace. The first trace and the second trace traverse at least two surfaces of the substrate, including a first surface of the substrate and a second surface of the substrate. At least two third location points are determined for a third trace based on the at least two first location points and the at least two second location points. The third trace is intermediate the first trace and the second trace. The third trace is formed on the at least two surfaces based on the at least two third location points.