Molded Interconnect LED Carrier for Motor Vehicle Lamp Spatial Distribution
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Solution Overview
Problem
Existing LED carrier technologies for motor vehicle lamps are complex and error-prone, particularly when trying to achieve precise spatial distribution of LEDs due to limitations in one-plane arrangements, and they often damage LEDs during assembly and operation.
Innovation Solution
The LED carrier is manufactured using Molded Interconnect Devices (MID) technology with integrated conductor tracks on the rear side, allowing for complex shapes and precise positioning of LEDs in multiple planes, and enabling soldering without exposing the LEDs to heat, thus preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If LED carrier boards are assembled from several individual flat plates to arrange LEDs in different levels, then the spatial distribution of LEDs is improved, but the assembly complexity and error rate increase significantly
Solution Approach 1:
The patent merges multiple individual LED carrier boards into a single integrated carrier structure. The LED carrier comprises a support structure with multiple levels that directly holds LEDs in different spatial positions, eliminating the need to assemble multiple separate carrier boards. This integration reduces the number of connection points and assembly steps while maintaining the desired three-dimensional LED arrangement.
Solution Approach 2:
The LED carrier is designed as a universal component that integrates multiple functions: it provides mechanical support for LEDs in various spatial positions, establishes electrical connections through integrated conductor tracks, and serves as the mounting structure for the entire LED array. This multi-functional design replaces the need for multiple specialized components.
2Manufacturing precision
If individual LED carrier boards are used to position LEDs precisely, then the positioning accuracy is improved, but the number of connection points and potential errors increase
Solution Approach 1:
The patent combines multiple connection functions into a single integrated LED carrier structure. The carrier includes integrated conductor tracks that provide electrical connections for multiple LEDs simultaneously, reducing the total number of connection points from many individual board connections to a unified connection system. This reduces the probability of connection failures.
3Ease of manufacture
If SMD LED chips are used with foil technology, then the assembly process is simplified, but the LEDs are exposed to high temperatures during reflow soldering which may cause damage
Solution Approach 1:
The patent introduces an intermediary protective structure - the LED carrier itself serves as a thermal barrier during the soldering process. The carrier is positioned between the heat source and the LEDs, shielding them from direct thermal exposure while still allowing the soldering process to complete successfully.
Solution Approach 2:
Instead of exposing LEDs to heat during assembly, the patent inverts the approach by shielding the LEDs from heat. The LED carrier is designed to be placed over or around the LEDs during soldering, creating a protective enclosure that blocks thermal energy from reaching the sensitive LED chips while maintaining electrical connectivity.
4Illumination intensity
If wired LEDs with special optics are used, then the light yield is improved, but the assembly process becomes more complex
Solution Approach 1:
The patent merges the LED, its optics, and its electrical connections into a single integrated unit on the LED carrier. The wired LEDs with special optics are mounted directly on the carrier structure, which integrates the optical components and electrical connections, eliminating the need for separate assembly steps for optics and electronics.
Data Source
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AI summary
The lamp has LEDs (3) arranged on a LED carrier (2), and a reflector provided with reflector chambers. The LEDs are arranged in a focal point of the respective chambers, and the carrier is produced as an injection-molded plastic part in molded interconnect devices (MID) procedure. The carrier has conductive paths by which the LEDs are electrically connected. The paths are arranged on a rear side of the carrier, where the rear side is turned away from the reflector. The LEDs are wired LEDs provided with pins, and are soldered on the rear side of the carrier by through plating.