Integrated Heat-Radiating PCB and Chassis Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat-radiating printed circuit board (PCB) and chassis assemblies experience degraded heat transfer and adhesion issues due to the use of thermal interface material (TIM), leading to reduced heat-radiating effectiveness and increased material costs, as well as potential delamination problems.
Innovation Solution
The integration of a heat-radiating PCB with a blanket, where the PCB is formed with bent metal substrates and insulation layers, eliminating the need for separate blanket manufacturing and TIM, thereby enhancing heat conduction and simplifying the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separate blanket and TIM are used to bond the heat-radiating PCB to the chassis, then the structure is flexible and allows separate manufacturing, but the heat transfer efficiency is degraded and adhesion problems occur
Solution Approach 1:
The patent merges the blanket and heat-radiating PCB into a single integrated structure where the PCB itself serves as the heat-radiating component. The metal substrate of the PCB is directly bonded to the chassis, eliminating the need for a separate blanket and TIM, thereby improving heat transfer efficiency while maintaining manufacturing feasibility through integrated construction
Solution Approach 2:
The patent extracts and eliminates the TIM (thermal interface material) from the heat transfer path by establishing direct contact between the metal substrate of the integrated PCB-blanket structure and the chassis. This removal of the intermediate TIM layer prevents heat transfer degradation and adhesion problems while maintaining the flexibility of separate manufacturing processes for the integrated unit
2Ease of manufacture
If a separate blanket and TIM are used to bond the heat-radiating PCB to the chassis, then the structure is flexible and allows separate manufacturing, but the adhesion reliability is degraded due to bonding issues
Solution Approach 1:
The patent merges the blanket and heat-radiating PCB into a single integrated structure that is then bonded as one unit to the chassis. This integration eliminates the separate bonding interfaces between blanket-TIM-PCB-chassis, reducing the number of potential adhesion failure points and improving overall reliability while allowing the integrated unit to be manufactured separately and installed as a complete assembly
Solution Approach 2:
The patent extracts and eliminates the TIM layer from the bonding sequence, removing the source of adhesion problems between the blanket and PCB. By establishing direct bonding between the integrated PCB-blanket structure and the chassis, the patent improves adhesion reliability while maintaining the advantage of separate manufacturing of the integrated unit
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration improves heat transfer efficiency, reduces manufacturing costs, and prevents delamination, maximizing heat-radiating characteristics while minimizing the use of TIM and separate blanket manufacturing processes.
Implementation Method 1
a metal substrate sequentially formed with an insulation layer and a circuit pattern
Data Source
Figure 1~4
Figure 5~6
AI summary
The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit mounted with a light emitting diode; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where one of the mounting units is mounted to the chassis via a thermal interface material to maximize the heat radiating characteristic of the PCB and to reduce the manufacturing cost.