Additive Manufacturing Ground Layer for Electrical Noise Reduction
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Solution Overview
Problem
Existing additive manufacturing methods for fabricating objects with integral circuits face challenges in reducing electrical noise and magnetic field interference, particularly in complex systems like MRI devices, which are costly and time-consuming to manufacture due to the need for careful shielding and cabling.
Innovation Solution
The method involves using additive manufacturing to deposit ground layers and insulation materials around electrical components, forming a Faraday cage-like structure to reduce noise and interference, and incorporating multi-material additive manufacturing techniques to create objects with integrated circuits, antennas, and signal circuits that are immune to external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional shielding and cabling methods are used in additive manufacturing, then noise and interference are reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple functions (shielding, grounding, insulation, and structural support) into a single integrated ground layer structure fabricated through additive manufacturing. This eliminates the need for separate shielding components and complex cabling assemblies, reducing overall device complexity while maintaining noise and interference reduction capabilities.
Solution Approach 2:
The ground layer structure serves multiple functions simultaneously: it provides electromagnetic shielding, establishes ground references for circuits, offers mechanical support, and enables thermal management. This multi-functionality reduces the number of separate components needed, thereby reducing manufacturing complexity and cost.
2Object-affected harmful factors
If traditional shielding methods are used, then noise reduction is achieved, but manufacturing time increases
Solution Approach 1:
The ground layer structure is pre-designed and fabricated as an integral part of the object during the additive manufacturing process itself, rather than being added as a separate post-processing step. This preliminary integration of shielding functionality into the base manufacturing process eliminates additional assembly time and accelerates overall production.
Solution Approach 2:
The patent replaces traditional mechanical assembly of separate shielding components and cabling with a single additive manufacturing process that deposits conductive materials layer-by-layer to form integrated ground structures. This substitution of mechanical assembly with automated material deposition significantly reduces manufacturing time.
3Object-affected harmful factors
If ground layers are deposited using additive manufacturing, then noise reduction is achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent utilizes changes in material conductivity parameters during additive manufacturing to create distinct functional regions. By controlling the deposition of conductive versus insulating materials and adjusting their electrical properties, the process achieves complex ground layer configurations without requiring complex mechanical or post-processing operations.
Solution Approach 2:
The invention employs composite material deposition, combining conductive materials (for ground layers and shielding) with insulating materials (for isolation and support structures) in a single additive manufacturing process. This composite approach enables the creation of multifunctional integrated structures while maintaining process simplicity through material property differentiation rather than structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient fabrication of objects with reduced noise and interference, making them more reliable and cost-effective, while also providing tamper-proof features by obscuring the internal design and operation from external probing and scanning.
Implementation Method 1
At least one material is deposited to define a ground layer on the base structure that is associated with the first electrical component and positioned to reduce electrical noise, RF signals, microwave signals, and/or magnetic field interference
Data Source
AI summary
A method of fabricating an object is provided. The method includes fabricating a base structure. A first electrical component is deposited or fabricated on or in the base structure. At least one insulation material is deposited to define a first layer on the base structure that is associated with the first electrical component and positioned to reduce electrical noise and/or magnetic field interference.