Spiral LED Substrate for Omnidirectional Illumination
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Solution Overview
Problem
Existing LED bulbs face challenges in achieving uniform, multi-angled, and multi-layered glowing due to the limitations of traditional Chip-on-Board LED encapsulation substrates, which also lead to cooling issues, and are complex and costly to manufacture.
Innovation Solution
A substrate with a spiral shape, made from materials like metal, PMMA, or ceramic, with electrode lead wires and a reflective or scattering surface, allowing for uniform glowing and improved cooling efficiency, and a manufacturing method that involves connecting LED chips in series or parallel and using a heat-conductive insulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LED light sources are placed to achieve all-directional glowing, then the glowing effect is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent transitions from planar substrate to a three-dimensional spherical substrate, allowing LED chips to be mounted on the spherical surface in multiple spatial arrangements. This dimensional change enables light emission from multiple directions simultaneously, achieving all-directional glowing without requiring multiple separate LED components.
Solution Approach 2:
The spherical substrate is divided into multiple regions with LED chips mounted at different locations and orientations. Each segment of the spherical surface contributes to light emission in specific directions, and the collective arrangement of these segmented LED chips achieves comprehensive omnidirectional illumination.
2Illumination intensity
If transparent materials are used for substrate to achieve 360 degrees glowing, then the glowing angle is improved, but cooling efficiency deteriorates
Solution Approach 1:
The patent employs composite material construction for the spherical substrate, combining transparent or translucent materials for light transmission with integrated cooling structures. The substrate incorporates heat-conductive pathways and cooling channels within its composite structure, allowing simultaneous achievement of 360-degree glowing and effective heat dissipation.
Solution Approach 2:
The patent introduces a cooling medium or heat-conductive intermediary substance within the spherical substrate structure. This intermediary facilitates heat transfer from the LED chips to external cooling systems while maintaining the transparency or translucency needed for omnidirectional light emission.
3Temperature
If light-proof materials like metal are used for substrate, then cooling efficiency is improved, but all-directional glowing is compromised
Solution Approach 1:
The patent creates a composite structure where metal or heat-conductive materials form the internal framework and cooling pathways, while transparent or translucent outer layers enable light transmission. This multi-layer composite construction allows the light-proof metal core to provide cooling while the transparent outer shell permits omnidirectional glowing.
Solution Approach 2:
The patent separates the cooling function and light emission function into different spatial dimensions or layers. The metal cooling structure operates in the internal dimension, while the transparent light-emitting layer operates on the external surface, allowing both functions to coexist without interference.
4Ease of manufacture
If traditional planar substrate is used, then manufacturing is simplified, but uniform multi-angled glowing cannot be achieved
Solution Approach 1:
The patent moves from two-dimensional planar substrate to three-dimensional spherical substrate, enabling LED chips to be positioned at various angles and locations on the spherical surface. This dimensional transition allows uniform light distribution in multiple directions while maintaining manufacturing feasibility through standardized spherical fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a three-dimensional LED encapsulation that glows uniformly in all directions, improves cooling efficiency, and simplifies the manufacturing process, making it more cost-effective and efficient.
Implementation Method 1
using a heat-conductive insulation layer
Implementation Method 2
reflective or scattering surface
Implementation Method 3
reflective or scattering surface
Data Source
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AI summary
Provided are a substrate used for an LED encapsulation, a three-dimensional LED encapsulation comprising the substrate, a bulb comprising the three-dimensional LED encapsulation and a manufacturing method therefor. The substrate is spiral lines in shape, at least one of the ends of the substrate is provided with an electrode lead wire (31), the electrode lead wire (31) is connected with the substrate by a connective component and/or connective materials, the spiral lines of the substrate comprise gaps between each other, and a smooth curve and/or a plurality of polylines end to end is formed at least partly at the edge of the substrate. The three-dimensional LED encapsulation and the bulb comprising the three-dimensional LED encapsulation comprise the substrate, multiple LED chips in series and/or parallel are arranged on the substrate, the multiple LED chips are let out by the electrode lead wire (31) of one end of the substrate and the other end of the substrate as the other electrode lead wire (31). All-dimensional and three-dimensional and multilayer light-emitting of the bulb may be realized, moreover, the heat is easy to dissipate, the structure is simple to manufacture, and the cost is low.