Multilayer Laminate Embedding Electronics in Thermoplastic
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Solution Overview
Problem
Current methods for manufacturing multilayer electronic devices face challenges such as optical defects, high costs due to thicker substrates, shear stresses leading to component detachment, and complexities in integrating electronics and graphics, particularly in backside injection molding, which results in yield losses and difficulties in accessing electrical circuitry.
Innovation Solution
The method involves combining electronics and graphical substrates with a thermoplastic layer to form a multilayer laminate, where the thermoplastic layer is heated to increase plasticity, allowing electronic components to be embedded, and the laminate is then thermoformed or over-molded, reducing the need for sequential forming steps and minimizing shear forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If backside injection molding is used to manufacture multilayer electronic devices, then electronics and graphics can be integrated in a single process, but optical defects occur that reveal circuitry and components to the user
Solution Approach 1:
The device is divided into separate modules: an electronics module containing circuitry and a graphics module containing display elements. These modules are manufactured independently and then assembled, allowing each to be optimized separately for their respective functions without compromising optical quality or manufacturing efficiency.
2Reliability
If thicker substrates are used to prevent optical defects, then circuitry protection is improved, but manufacturing costs increase significantly
Solution Approach 1:
The electronics module is nested within a protective housing structure that provides mechanical protection and shielding. This allows thin substrates to be used for the actual circuitry layers while the outer housing provides the necessary protection, avoiding the cost penalty of thick substrates.
3Reliability
If injection molding is used to form multilayer structures, then sealing and protection from environment is achieved, but high shear stresses detach components from the surface
Solution Approach 1:
Components are pre-attached to the substrate using adhesive bonding before the injection molding process. This preliminary bonding ensures components can withstand the shear stresses of molding without detaching, while the molding process subsequently provides environmental sealing.
4Strength
If stronger glues are used to prevent component detachment, then component attachment is improved, but manual application steps are required and contacting issues arise
Solution Approach 1:
The molding process itself provides the bonding function. The injection molded material flows around and secures components during forming, eliminating the need for separate adhesive application steps while maintaining strong attachment and avoiding contacting issues.
5Manufacturing precision
If segmentation of molded layer is used to create light guides, then optical cross talk is prevented, but separate molds are required for each material island
Solution Approach 1:
Multiple light guide segments that require separate molds in traditional approaches are merged into a single integrated molded layer. The injection molding process creates optically isolated regions within one continuous structure, achieving optical cross-talk prevention without requiring multiple separate molds.
6Reliability
If rigid or flex connectors are used to access electrical circuitry, then electrical connection is established, but stress peaks at the transition from molded part causing susceptibility to failure
Solution Approach 1:
A flexible printed circuit board (FPC) is used as the connector, allowing it to bend and accommodate stress without failure. The FPC provides reliable electrical connection while its flexibility enables it to absorb mechanical stresses at the transition from the molded part without creating stress concentration points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of robust, cost-effective multilayer electronic devices with embedded components and graphics, providing protection from further processing stresses and allowing easy external contact, while avoiding the need for backside injection molding.
Implementation Method 1
by heating at least the thermoplastic layer to a lamination temperature for increasing a plasticity of the thermoplastic material
Implementation Method 2
for increasing a plasticity of the thermoplastic material
Implementation Method 3
the multilayer laminate is thermoformed into a desired, e.g. three-dimensional shape
Data Source
AI summary
An electronic device (100) comprises an electronics substrate (10) with at least one light emitting device (12), a cover substrate (20) with a graphical pattern including at least one window (22), and a thermoplastic layer (30) there between. A multilayer laminate (40) of the device (100) is formed by combining the electronics substrate (10) and the cover substrate (20) by lamination with protruding electronic components (11,12) facing the thermoplastic layer (30). At least the thermoplastic layer (30) is heated to a lamination temperature (T1) for increasing a plasticity of the thermoplastic material (30m). The electronic components (11,12) are pushed by the lamination into the heated thermoplastic layer (30) for embedding the electronic components (11,12) in the thermoplastic material (30m).